发明申请
- 专利标题： Method for Mitigating Cure Shrinkage in High Temperature-Processed Thermosetting Adhesives and SMC
- 专利标题（中）： 降低高温加热热固性粘合剂和SMC固化收缩的方法
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申请号： US13657245申请日： 2012-10-22
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公开(公告)号： US20140011016A1公开(公告)日： 2014-01-09
- 发明人: Sampath K. VANIMISETTI , Chen-Shih WANG , Vidyashankar R. BURAVALLA
- 申请人： GM GLOBAL TECHNOLOGY OPERATIONS LLC
- 申请人地址： US MI Detroit
- 专利权人： GM GLOBAL TECHNOLOGY OPERATIONS LLC
- 当前专利权人： GM GLOBAL TECHNOLOGY OPERATIONS LLC
- 当前专利权人地址： US MI Detroit
- 优先权： IN757/KOL/2012 20120709
- 主分类号： C08K7/24
- IPC分类号： C08K7/24 ; B32B7/12 ; B32B37/12 ; C09J11/08
摘要：
A thermosetting polymer composite composition (such as thermosetting SMC composition) or a thermosetting adhesive composition containing reduced-volume hollow shape-memory alloy particles in the thermosetting polymer composite composition or adhesive composition experiences little or no volume loss during a curing at a temperature above the transformation temperature for the particles.