专利检索 ap:("GM GLOBAL TECHNOLOGY OPERATIONS LLC") AND inv:"Vidyashankar R. BURAVALLA" 第 1 页

1.

发明申请
Method for Mitigating Cure Shrinkage in High Temperature-Processed Thermosetting Adhesives and SMC 有权
标题翻译：降低高温加热热固性粘合剂和SMC固化收缩的方法

公开(公告)号：US20140011016A1

公开(公告)日：2014-01-09

申请号：US13657245

申请日：2012-10-22

申请人： GM GLOBAL TECHNOLOGY OPERATIONS LLC

发明人： Sampath K. VANIMISETTI , Chen-Shih WANG , Vidyashankar R. BURAVALLA

IPC分类号： C08K7/24 , B32B7/12 , B32B37/12 , C09J11/08

CPC分类号： C09J11/04 , B29C61/00 , B29C65/4835 , B29C65/4855 , B29C65/487 , B29C65/489 , B29C66/006 , B29C66/721 , B29C66/7311 , B29C66/7315 , B29C66/73941 , B29K2105/165 , B29K2995/0096 , C08K7/24 , Y10T428/249984

摘要： A thermosetting polymer composite composition (such as thermosetting SMC composition) or a thermosetting adhesive composition containing reduced-volume hollow shape-memory alloy particles in the thermosetting polymer composite composition or adhesive composition experiences little or no volume loss during a curing at a temperature above the transformation temperature for the particles.

摘要翻译： 热固性聚合物复合组合物（例如热固性SMC组合物）或在热固性聚合物复合组合物或粘合剂组合物中含有体积小的中空形状记忆合金颗粒的热固性粘合剂组合物在固化过程中在高于颗粒的转变温度。

2.

发明申请
Methodology and Mechanisms for Enhancing High Ambient Temperature Performance in Shape Memory Alloy Applications 有权
标题翻译：在形状记忆合金应用中提高高环境温度性能的方法和机制

公开(公告)号：US20140007572A1

公开(公告)日：2014-01-09

申请号：US13688863

申请日：2012-11-29

申请人： GM GLOBAL TECHNOLOGY OPERATIONS LLC

发明人： Vidyashankar R. BURAVALLA , Shivaram AC , Ashish KHANDELWAL , Christopher B. CHURCHILL

IPC分类号： F03G7/06

CPC分类号： F03G7/065

摘要： An actuator comprising an SMA element and a thermally responsive element that adjusts bias stress improves high ambient temperature operation.

摘要翻译： 包括SMA元件和调节偏压应力的热响应元件的致动器改善了高环境温度操作。