发明申请
US20140029193A1 COMPUTER SYSTEM COOLING USING AN EXTERNALLY-APPLIED FLUID CONDUIT
有权
使用外部应用流体管道的计算机系统冷却
- 专利标题: COMPUTER SYSTEM COOLING USING AN EXTERNALLY-APPLIED FLUID CONDUIT
- 专利标题(中): 使用外部应用流体管道的计算机系统冷却
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申请号: US13560617申请日: 2012-07-27
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公开(公告)号: US20140029193A1公开(公告)日: 2014-01-30
- 发明人: Shareef F. Alshinnawi , Gary D. Cudak , Christopher J. Hardee , Randall C. Humes , Adam Roberts , Edward S. Suffern , J. Mark Weber
- 申请人: Shareef F. Alshinnawi , Gary D. Cudak , Christopher J. Hardee , Randall C. Humes , Adam Roberts , Edward S. Suffern , J. Mark Weber
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: G06F1/20
- IPC分类号: G06F1/20
摘要:
A computer system includes a rack-mountable server unit with a closed server housing. The server housing has a channel with a recessed channel wall in conductive thermal communication with a processor or other heat-generating component. An elongate conduit is received into the channel of the server housing in conductive thermal communication with an external surface of the server housing. The server is cooled by conductive fluid flow through the conduit, with no appreciable airflow through the server housing. The system may be operated in an optional burst cooling mode, wherein a volume of cooling fluid is trapped in the conduit for a period of time before being quickly released.
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