Invention Application
- Patent Title: ELECTRODE PAD, PRINTED CIRCUIT BOARD USING THE SAME, AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
- Patent Title (中): 电极板，使用其的印刷电路板和制造印刷电路板的方法
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Application No.: US13706863Application Date: 2012-12-06
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Publication No.: US20140087205A1Publication Date: 2014-03-27
- Inventor: Jung Youn PANG , Shimoji Teruaki , Eun Heay Lee , Seong Min Cho , Chi Seong Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2012-0105298 20120921
- Main IPC: B32B15/01
- IPC: B32B15/01 ; C23C18/42 ; C23C28/02 ; B32B15/04
Abstract:
There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.
Public/Granted literature
- US08946911B2 Electrode pad, printed circuit board using the same, and method of manufacturing printed circuit board Public/Granted day:2015-02-03
Information query
