公开(公告)号：US20140087205A1

公开(公告)日：2014-03-27

申请号：US13706863

申请日：2012-12-06

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Youn PANG ,  Shimoji Teruaki ,  Eun Heay Lee ,  Seong Min Cho ,  Chi Seong Kim

IPC: B32B15/01 ,  C23C18/42 ,  C23C28/02 ,  B32B15/04

CPC classification number: B32B15/018 ,  B32B15/043 ,  C22C5/02 ,  C22C5/04 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/42 ,  C23C18/44 ,  C23C18/54 ,  C23C28/021 ,  C23C28/023 ,  C25D5/10 ,  H01L24/00 ,  H05K3/244 ,  H05K2201/09472 ,  Y10T428/12396 ,  Y10T428/12514 ,  Y10T428/12868 ,  Y10T428/12875

Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.

Abstract translation: 提供一种电极焊盘，包括：连接端子部; 包括形成在所述连接端子部上的钯磷（Pd-P）的第一镀层; 以及包含形成在第一镀层上的钯（Pd）的第二镀层。

公开(公告)号：US08946911B2

公开(公告)日：2015-02-03

申请号：US13706863

申请日：2012-12-06

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jung Youn Pang ,  Shimoji Teruaki ,  Eun Heay Lee ,  Seong Min Cho ,  Chi Seong Kim

IPC: H01L23/498 ,  B32B15/01 ,  B32B15/04 ,  C23C18/42 ,  C23C28/02 ,  C25D5/10 ,  C23C18/16 ,  C23C18/44 ,  C23C18/54 ,  H05K3/24 ,  H01L23/00 ,  C22C5/02 ,  C22C5/04 ,  C23C18/18

CPC classification number: B32B15/018 ,  B32B15/043 ,  C22C5/02 ,  C22C5/04 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1844 ,  C23C18/42 ,  C23C18/44 ,  C23C18/54 ,  C23C28/021 ,  C23C28/023 ,  C25D5/10 ,  H01L24/00 ,  H05K3/244 ,  H05K2201/09472 ,  Y10T428/12396 ,  Y10T428/12514 ,  Y10T428/12868 ,  Y10T428/12875

Abstract: There is provided an electrode pad including: a connection terminal part; a first plating layer including palladium phosphorus (Pd—P) formed on the connection terminal part; and a second plating layer including palladium (Pd) formed on the first plating layer.

Abstract translation: 提供一种电极焊盘，包括：连接端子部; 包括形成在所述连接端子部上的钯磷（Pd-P）的第一镀层; 以及包含形成在第一镀层上的钯（Pd）的第二镀层。

公开(公告)号：US11490503B2

公开(公告)日：2022-11-01

申请号：US17204058

申请日：2021-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hwa Park ,  Chi Seong Kim ,  Eun Heay Lee ,  Yo Han Song ,  Gun Hwi Hyung ,  Jae Heun Lee ,  Deok Man Kang ,  Jin Oh Park

IPC: H05K3/22 ,  H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/30

Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.

公开(公告)号：US20220022310A1

公开(公告)日：2022-01-20

申请号：US17204058

申请日：2021-03-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hwa Park ,  Chi Seong Kim ,  Eun Heay Lee ,  Yo Han Song ,  Gun Hwi Hyung ,  Jae Heun LEE ,  Deok Man Kang ,  Jin Oh Park

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/22 ,  H05K3/00

Abstract: A substrate with an electronic component embedded therein includes: a core structure having a cavity; a metal layer disposed on a bottom surface of the cavity of the core structure; and an electronic component disposed on the metal layer in the cavity of the core structure. The substrate with the electronic component embedded therein has an excellent heat dissipation effect.