发明申请
- 专利标题： INJECTOR FOR FORMING FILMS RESPECTIVELY ON A STACK OF WAFERS
- 专利标题（中）： 注射器相对于水平堆叠形成膜
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申请号： US13716052申请日： 2012-12-14
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公开(公告)号： US20140170319A1公开(公告)日： 2014-06-19
- 发明人: Wei-Che Hsieh , Brian Wang , Tze-Liang Lee , Yi-Hung Lin , Hao-Ming Lien , Shiang-Rung Tsai , Tai-Chun Huang
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsinchu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsinchu
- 主分类号： B05B1/14
- IPC分类号： B05B1/14
摘要：
An injector for forming films respectively on a stack of wafers is provided. The injector includes a plurality of hole structures. Every adjacent two of the wafers have therebetween a wafer spacing, and each of the wafers has a working surface. The hole structures respectively correspond to the respective wafer spacings. The working surface and a respective hole structure have therebetween a parallel distance. The parallel distance is larger than a half of the wafer spacing. A wafer processing apparatus and a method for forming films respectively on a stack of wafers are also provided.
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