发明申请
- 专利标题： COBALT BASED INTERCONNECTS AND METHODS OF FABRICATION THEREOF
- 专利标题（中）： 基于COBALT的互连及其制造方法
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申请号： US13730184申请日： 2012-12-28
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公开(公告)号： US20140183738A1公开(公告)日： 2014-07-03
- 发明人: Christopher J. Jezewski , James S. Clarke , Tejaswi K. Indukuri , FLorian Gstrein , Daniel J. Zierath
- 申请人： Christopher J. Jezewski , James S. Clarke , Tejaswi K. Indukuri , FLorian Gstrein , Daniel J. Zierath
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/768
摘要：
A metal interconnect comprising cobalt and method of forming a metal interconnect comprising cobalt are described. In an embodiment, a metal interconnect comprising cobalt includes a dielectric layer disposed on a substrate, an opening formed in the dielectric layer such that the substrate is exposed. The embodiment further includes a seed layer disposed over the substrate and a fill material comprising cobalt formed within the opening and on a surface of the seed layer.