发明申请
- 专利标题: Optoelectronic Semiconductor Chip
- 专利标题(中): 光电半导体芯片
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申请号: US14122134申请日: 2012-04-26
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公开(公告)号: US20140197435A1公开(公告)日: 2014-07-17
- 发明人: Markus Maute , Karl Engl , Sebastian Taeger , Robert Walter , Johannes Stocker
- 申请人: OSRAM OPTO SEMICONDUCTORS GMBH
- 申请人地址: DE Regensburg
- 专利权人: OSRAM OPTO SEMICONDUCTORS GMBH
- 当前专利权人: OSRAM OPTO SEMICONDUCTORS GMBH
- 当前专利权人地址: DE Regensburg
- 优先权: DE102011102376.7 20110525; DE102011109942.9 20110810
- 国际申请: PCT/DE2012/100118 WO 20120426
- 主分类号: H01L33/42
- IPC分类号: H01L33/42 ; H01L33/60
摘要:
An optoelectronic semiconductor chip includes a semiconductor body of semiconductor material, a p-contact layer and an n-contact layer. The semiconductor body includes an active layer intended for generating radiation. The semiconductor body includes a p-side and an n-side, between which the active layer is arranged. The p-contact layer is intended for electrical contacting the p-side. The n-contact layer is intended for electrical contacting the n-side 1b. The n-contact layer contains a TCO layer and a minor layer, the TCO-layer being arranged between the n-side of the semiconductor body and the minor layer.
公开/授权文献
- US09373765B2 Optoelectronic semiconductor chip 公开/授权日:2016-06-21
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