Invention Application
- Patent Title: CHEMICAL MECHANICAL POLISHING APPARATUS AND METHODS
- Patent Title (中): 化学机械抛光装置及方法
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Application No.: US14143276Application Date: 2013-12-30
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Publication No.: US20140199840A1Publication Date: 2014-07-17
- Inventor: Rajeev Bajaj , Thomas H. Osterheld , Hung Chen , Terrance Y. Lee
- Applicant: Applied Materials, Inc.
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/67
Abstract:
In one aspect, a substrate polishing apparatus is disclosed. The apparatus has a polishing platform having two or more zones, each zone adapted to contain a different slurry component. In another aspect, a substrate polishing system is provided having a holder to hold a substrate, a polishing platform having a polishing pad, and a distribution system adapted to dispense, in a timed sequence, at least two different slurry components selected from a group consisting of an oxidation slurry component, a material removal slurry component, and a corrosion inhibiting slurry component. Polishing methods and systems adapted to polish substrates are provided, as are numerous other aspects.
Information query
IPC分类:
