- 专利标题： MAKING MULTI-LAYER MICRO-WIRE STRUCTURE
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申请号： US13779939申请日： 2013-02-28
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公开(公告)号： US20140242297A1公开(公告)日： 2014-08-28
- 发明人: Hwei-Ling Yau , David Paul Trauenicht , John Andrew Lebens , Yongcai Wang , Ronald Steven Cok
- 申请人： Hwei-Ling Yau , David Paul Trauenicht , John Andrew Lebens , Yongcai Wang , Ronald Steven Cok
- 主分类号： H01B13/00
- IPC分类号： H01B13/00
摘要：
A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
公开/授权文献
- US08828503B1 Making multi-layer micro-wire structure 公开/授权日：2014-09-09