专利检索 ap:("Hwei-Ling Yau" OR "David Paul Trauenicht" OR "John Andrew Lebens" OR "Yongcai Wang" OR "Ronald Steven Cok") AND inv:"David Paul Trauenicht" 第 1 页

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发明申请
MAKING MULTI-LAYER MICRO-WIRE STRUCTURE 有权

公开(公告)号：US20140242297A1

公开(公告)日：2014-08-28

申请号：US13779939

申请日：2013-02-28

申请人： Hwei-Ling Yau , David Paul Trauenicht , John Andrew Lebens , Yongcai Wang , Ronald Steven Cok

发明人： Hwei-Ling Yau , David Paul Trauenicht , John Andrew Lebens , Yongcai Wang , Ronald Steven Cok

IPC分类号： H01B13/00

CPC分类号： G01N27/403 , B05D5/12 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K3/0011 , H05K3/107 , H05K3/42 , H05K3/46 , H05K3/467

摘要： A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.