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公开(公告)号：US20140242297A1
公开(公告)日：2014-08-28
申请号：US13779939
申请日：2013-02-28
IPC分类号： H01B13/00
CPC分类号： G01N27/403 , B05D5/12 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K3/0011 , H05K3/107 , H05K3/42 , H05K3/46 , H05K3/467
摘要： A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
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公开(公告)号：US20140322436A1
公开(公告)日：2014-10-30
申请号：US14326806
申请日：2014-07-09
IPC分类号： H05K3/46
CPC分类号： G01N27/403 , B05D5/12 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K3/0011 , H05K3/107 , H05K3/42 , H05K3/46 , H05K3/467
摘要： A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
摘要翻译： 制造多层微线结构的方法包括提供具有表面并在表面中形成多个微通道的基底。 第一材料组合物仅位于每个微通道中而不在表面上的第一层中。 与第一材料组合物不同的第二材料组合物仅位于每个微通道而不在表面上的第一层中，不同于第一层。 第一层中的第一材料组合物和第二层中的第二材料组合物在每个微通道中形成导电多层微线。
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公开(公告)号：US20140239504A1
公开(公告)日：2014-08-28
申请号：US13779917
申请日：2013-02-28
IPC分类号： H01L33/42
CPC分类号： G01N27/126 , G01N27/07 , G02F1/13439 , G06F3/044 , G06F2203/04103 , H05K3/0014 , H05K3/1258 , H05K2201/0108 , H05K2201/0112 , H05K2201/0257 , H05K2201/0269 , H05K2201/0272 , H05K2201/0338 , H05K2201/0376 , H05K2201/2054 , H05K2203/0108 , H05K2203/1131 , H05K2203/1476
摘要： A multi-layer micro-wire structure includes a substrate having a surface. A plurality of micro-channels is formed in the substrate. A first material composition is located in a first layer only in each micro-channel and not on the substrate surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the substrate surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
摘要翻译： 多层微线结构包括具有表面的基板。 在基板上形成多个微通道。 第一材料组合物仅位于每个微通道中的第一层中，而不位于基底表面上。 不同于第一材料组合物的第二材料组合物仅位于每个微通道而不是在基板表面上的不同于第一层的第二层中。 第一层中的第一材料组合物和第二层中的第二材料组合物在每个微通道中形成导电多层微线。
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公开(公告)号：US08828503B1
公开(公告)日：2014-09-09
申请号：US13779939
申请日：2013-02-28
CPC分类号： G01N27/403 , B05D5/12 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K3/0011 , H05K3/107 , H05K3/42 , H05K3/46 , H05K3/467
摘要： A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.
摘要翻译： 制造多层微线结构的方法包括提供具有表面并在表面中形成多个微通道的基底。 第一材料组合物仅位于每个微通道中而不在表面上的第一层中。 与第一材料组合物不同的第二材料组合物仅位于每个微通道而不在表面上的第一层中，不同于第一层。 第一层中的第一材料组合物和第二层中的第二材料组合物在每个微通道中形成导电多层微线。
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公开(公告)号：US20160047766A1
公开(公告)日：2016-02-18
申请号：US14460578
申请日：2014-08-15
CPC分类号： G01N27/126 , G01N27/07 , G02F1/13439 , G06F3/044 , G06F2203/04103 , H05K3/0014 , H05K3/1258 , H05K2201/0108 , H05K2201/0112 , H05K2201/0257 , H05K2201/0269 , H05K2201/0272 , H05K2201/0338 , H05K2201/0376 , H05K2201/2054 , H05K2203/0108 , H05K2203/1131 , H05K2203/1476
摘要： An imprinted electronic sensor structure on a substrate for sensing an environmental factor includes a cured layer having a layer surface located on the substrate. Spatially separated micro-channels extend from the layer surface into the cured layer. A multi-layer micro-wire is formed in each micro-channel. Each multi-layer micro-wire includes at least a conductive layer and a reactive layer. The reactive layer is exposed to the environmental factor. The conductive layer is a cured electrical conductor located only within the micro-channel and at least a portion of the reactive layer responds to the environmental factor.
摘要翻译： 用于感测环境因素的基板上的印刷电子传感器结构包括具有位于基板上的层表面的固化层。 空间分离的微通道从层表面延伸到固化层。 在每个微通道中形成多层微线。 每个多层微线包括至少一个导电层和一个反应层。 反应层暴露于环境因素。 导电层是仅位于微通道内的固化电导体，并且反应层的至少一部分响应于环境因素。
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公开(公告)号：US09005744B2
公开(公告)日：2015-04-14
申请号：US13751464
申请日：2013-01-28
IPC分类号： B32B27/32 , G11B11/105 , H05K1/00 , H05K1/02
CPC分类号： H05K1/0296 , G06F3/044 , H05K1/02 , H05K1/0289 , H05K3/1258 , H05K2201/0108 , H05K2201/0376 , H05K2201/09227 , H05K2201/09272 , H05K2201/09681 , H05K2201/09727 , Y10T428/26
摘要： A conductive micro-wire structure includes a substrate. A plurality of spaced-apart electrically connected micro-wires is formed on or in the substrate forming the conductive micro-wire structure. The conductive micro-wire structure has a transparency of less than 75% and greater than 0%.
摘要翻译： 导电微线结构包括衬底。 多个间隔开的电连接的微线形成在形成导电微线结构的衬底上或衬底中。 导电微线结构具有小于75％且大于0％的透明度。
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公开(公告)号：US20140209355A1
公开(公告)日：2014-07-31
申请号：US13751430
申请日：2013-01-28
IPC分类号： H05K1/02
CPC分类号： H05K1/0296 , G06F3/0412 , G06F3/044 , G06F2203/04103 , G06F2203/04112 , H05K2201/0108 , H05K2201/09681 , H05K2201/09727
摘要： A pattern of micro-wires forming an electrical conductor includes a plurality of spaced-apart first micro-wires extending in a first direction. A plurality of spaced-apart second micro-wires extends in a second direction different from the first direction. Each second micro-wire is electrically connected to at least two first micro-wires and at least one second micro-wire has a width less than at least one of the widths of the first micro-wires.
摘要翻译： 形成电导体的微线的图案包括沿第一方向延伸的多个间隔开的第一微细线。 多个间隔开的第二微细线沿与第一方向不同的第二方向延伸。 每个第二微线电连接到至少两个第一微线，并且至少一个第二微线具有小于第一微线的宽度中的至少一个宽度的宽度。
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公开(公告)号：US20140209357A1
公开(公告)日：2014-07-31
申请号：US13751443
申请日：2013-01-28
IPC分类号： H05K1/02
CPC分类号： H05K1/0296 , G06F3/041 , G06F2203/04112 , H05K2201/0108 , H05K2201/10136 , H05K2201/10151
摘要： Micro-wires are arranged to form an electrical conductor connected to an electrode structure. The electrical conductor includes a plurality of spaced-apart first micro-wires extending in a first direction, wherein one of the first micro-wires is a connection micro-wire. A plurality of spaced-apart second micro-wires extends in a second direction different from the first direction. At least two adjacent second micro-wires are spaced apart by a distance greater than the spacing between at least two adjacent first micro-wires. Each second micro-wire is electrically connected to at least two first micro-wires. The electrode structure includes a plurality of electrically connected third micro-wires electrically connected to the connection micro-wire at spaced-apart connection locations and at least some of the adjacent connection locations are separated by a distance greater than any of the distances separating the second micro-wires.
摘要翻译： 微线布置成形成连接到电极结构的电导体。 电导体包括沿第一方向延伸的多个间隔开的第一微细线，其中第一微线中的一个是连接微线。 多个间隔开的第二微细线沿与第一方向不同的第二方向延伸。 至少两个相邻的第二微细线彼此隔开距离大于至少两个相邻的第一微细线之间的距离。 每个第二微线电连接到至少两个第一微线。 电极结构包括多个电连接的第三微线，其在间隔开的连接位置处电连接到连接微线，并且至少一些相邻的连接位置被隔开一段距离，该距离大于将第二 微线。
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公开(公告)号：US20160122559A1
公开(公告)日：2016-05-05
申请号：US14526595
申请日：2014-10-29
IPC分类号： C09D5/16
CPC分类号： C09D5/1681 , C09D5/14 , C09D5/1693
摘要： An imprinted multi-layer structure includes a support and a structured bi-layer on or over the support, The structured bi-layer includes a first cured layer having a first cross-linked material on or over the support. A second cured layer has a second material different from the first material on or over the first cured layer on a side of the first cured layer opposite the support. The structured bi-layer has at least a depth greater than the thickness of the second cured layer. The first material is cross-linked to the second material.
摘要翻译： 印刷的多层结构包括在支撑体上或上方的支撑体和结构的双层。结构化双层包括第一固化层，其在载体上或上方具有第一交联材料。 第二固化层在第一固化层的与载体相对的一侧上具有与第一固化层上或第一固化层上方的第一材料不同的第二材料。 结构化双层至少具有比第二固化层的厚度大的深度。 第一种材料与第二种材料交联。
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公开(公告)号：US20140209358A1
公开(公告)日：2014-07-31
申请号：US13751450
申请日：2013-01-28
IPC分类号： H05K1/02
CPC分类号： H05K1/0296 , G06F3/044 , H05K1/02 , H05K1/0289 , H05K3/1258 , H05K2201/0108 , H05K2201/0376 , H05K2201/09227 , H05K2201/09272 , H05K2201/09681 , H05K2201/09727 , Y10T428/26
摘要： An electrical conductor includes a substrate having micro-channels formed in the substrate. A plurality of spaced-apart first micro-wires is located on or in the micro-channels, the first micro-wires extending across the substrate in a first direction. A plurality of spaced-apart second micro-wires is located on or in the micro-channels, the second micro-wires extending across the substrate in a second direction different from the first direction. Each second micro-wire is electrically connected to at least two first micro-wires and at least one of the second micro-wires has a width less than the width of at least one of the first micro-wires.
摘要翻译： 电导体包括在衬底中形成有微通道的衬底。 多个间隔开的第一微电线位于微通道上或微通道中，第一微电线在第一方向上延伸穿过衬底。 多个间隔开的第二微电线位于微通道上或微通道中，第二微电线沿与第一方向不同的第二方向延伸穿过衬底。 每个第二微线电连接到至少两个第一微线，并且至少一个第二微线的宽度小于第一微线中的至少一个的宽度。
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