A device includes a conductive via to provide an electrical path through a substrate. The device further includes a conductive element. The device further includes a fuse coupled to the conductive via and coupled to the conductive element to provide a conductive path between the conductive via and the conductive element. The conductive path enables testing of continuity of at least a portion of the conductive via. The fuse is configured to be disabled after the testing of the continuity of the conductive via.