公开(公告)号：US20140266286A1

公开(公告)日：2014-09-18

申请号：US13801009

申请日：2013-03-13

Applicant: QUALCOMM INCORPORATED

Inventor： Vidhya Ramachandran ,  Shiqun Gu ,  Brian M. Henderson ,  Michael Scott DiBattista ,  Babak Motamedi ,  George F. Gaut

IPC: H01L23/522 ,  H01L23/525 ,  G01R31/26 ,  G06F17/50

CPC classification number: H01L23/5256 ,  G01R31/026 ,  G01R31/2884 ,  G06F17/5068 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A device includes a conductive via to provide an electrical path through a substrate. The device further includes a conductive element. The device further includes a fuse coupled to the conductive via and coupled to the conductive element to provide a conductive path between the conductive via and the conductive element. The conductive path enables testing of continuity of at least a portion of the conductive via. The fuse is configured to be disabled after the testing of the continuity of the conductive via.

Abstract translation: 一种器件包括导电通孔以提供通过衬底的电路径。 该装置还包括导电元件。 该器件还包括耦合到导电通孔并且耦合到导电元件的熔丝，以在导电通孔和导电元件之间提供导电路径。 导电路径使得能够测试导电通孔的至少一部分的连续性。 保险丝被配置为在测试导电通孔的连续性后禁用。