发明申请
US20140346743A1 MULTI-ZONED PLASMA PROCESSING ELECTROSTATIC CHUCK WITH IMPROVED TEMPERATURE UNIFORMITY
审中-公开
具有改进温度均匀性的多区等离子体处理静电卡
- 专利标题: MULTI-ZONED PLASMA PROCESSING ELECTROSTATIC CHUCK WITH IMPROVED TEMPERATURE UNIFORMITY
- 专利标题(中): 具有改进温度均匀性的多区等离子体处理静电卡
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申请号: US14447557申请日: 2014-07-30
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公开(公告)号: US20140346743A1公开(公告)日: 2014-11-27
- 发明人: Hamid Tavassoli , Surajit Kumar , Kallol Bera , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger, JR.
- 申请人: Hamid Tavassoli , Surajit Kumar , Kallol Bera , Xiaoping Zhou , Shane C. Nevil , Douglas A. Buchberger, JR.
- 主分类号: B23B31/28
- IPC分类号: B23B31/28 ; B23Q3/15
摘要:
An electrostatic chuck assembly including a dielectric layer with a top surface to support a workpiece. A cooling channel base disposed below the dielectric layer includes a plurality of inner fluid conduits disposed beneath an inner portion of the top surface, and a plurality of outer fluid conduits disposed beneath an outer portion of the top surface. A chuck assembly includes a thermal break disposed within the cooling channel base between the inner and outer fluid conduits. A chuck assembly includes a fluid distribution plate disposed below the cooling channel base and the base plate to distribute a heat transfer fluid delivered from a common input to each inner or outer fluid conduit. The branches of the inner input manifold may have substantially equal fluid conductance.