Invention Application
US20140376694A1 SUBSTRATE MEASUREMENT APPARATUS AND SUBSTRATE MEASUREMENT METHOD
审中-公开
基板测量装置和基板测量方法
- Patent Title: SUBSTRATE MEASUREMENT APPARATUS AND SUBSTRATE MEASUREMENT METHOD
- Patent Title (中): 基板测量装置和基板测量方法
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Application No.: US14021030Application Date: 2013-09-09
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Publication No.: US20140376694A1Publication Date: 2014-12-25
- Inventor: Hideaki ABE , Yasuhiko ISHIBASHI
- Applicant: Kabushiki Kaisha Toshiba
- Applicant Address: JP Minato-ku
- Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee: KABUSHIKI KAISHA TOSHIBA
- Current Assignee Address: JP Minato-ku
- Main IPC: G01N23/20
- IPC: G01N23/20 ; G01N23/207

Abstract:
In accordance with an embodiment, a substrate measurement apparatus circuit includes a light source, a detector, a data calculation unit, a mirror unit, a mirror drive unit, and a mirror drive calculation unit. The light source applies the electromagnetic waves to a measurement target substrate. The detector detects the electromagnetic waves diffracted or scattered by the application of the electromagnetic waves to the substrate. The data calculation unit processes a signal from the detector to acquire substrate information. The mirror unit includes a deflecting mirror which is adjusted to an optical condition where incident electromagnetic waves are totally reflected to control the track of the electromagnetic waves. The mirror drive unit drives the deflecting mirror in at least one of vertical, horizontal, and rotational directions. The mirror drive calculation unit calculates a drive amount to drive the deflecting mirror in at least one of the vertical, horizontal, and rotational directions.
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