Invention Application
US20150000599A1 Apparatus and System for Preventing Backside Peeling Defects on Semiconductor Wafers
审中-公开
用于防止半导体晶片背面剥离缺陷的装置和系统
- Patent Title: Apparatus and System for Preventing Backside Peeling Defects on Semiconductor Wafers
- Patent Title (中): 用于防止半导体晶片背面剥离缺陷的装置和系统
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Application No.: US13929297Application Date: 2013-06-27
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Publication No.: US20150000599A1Publication Date: 2015-01-01
- Inventor: Yen-Yu Chen , Wei-Jen Chen , Yi-Chen Chiang , Tsang-Yang Liu , Chang-Sheng Lee , Wei-Chen Liao , Wei Zhang
- Applicant: Taiwan Semiconductor Manufacturing Co., LTD.
- Main IPC: H01L21/02
- IPC: H01L21/02
Abstract:
A apparatus includes a susceptor and a non-reactive gas source. The susceptor has through holes and a wafer support surface. Each through hole includes a lift pin and a lift pin head. The lift pin has a vertical degree of motion in the through hole to lift up or place a wafer on the susceptor. The lift pin head has at least one flow channel structure running from its first surface at least partially exposed to a bottom side of the susceptor through its second surface exposed to a top side of the susceptor wherein the lift pin. The non-reactive gas source is configured to flow a gas to a backside of the wafer through the flow channel structure through the bottom side of the susceptor.
Public/Granted literature
- US10163676B2 Apparatus and system for preventing backside peeling defects on semiconductor wafers Public/Granted day:2018-12-25
Information query
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