A curable resin composition comprising a (meth)acrylate monomer having an aromatic ring, a non-conjugated vinylidene group-containing compound represented by the general formula below, and a thermal or a photo-radical polymerization initiator makes it possible to produce a cured product with minimized occurrence of burring during molding and high product yield after molding. The cured product has good heat coloration resistance and low Abbe's number. R11, R12, R15, and R16 represent a substituent and A represents an atomic group necessary for forming a cyclic structure.