发明申请
- 专利标题: RESIN COMPOSITION FOR PRINTED WIRING BOARDS
- 专利标题(中): 印刷电路板用树脂组合物
-
申请号: US14130741申请日: 2012-07-03
-
公开(公告)号: US20150034369A1公开(公告)日: 2015-02-05
- 发明人: Naoki Kashima , Keiichi Hasebe , Seiji Shika , Yoshinori Mabuchi , Yoshihiro Kato
- 申请人: Naoki Kashima , Keiichi Hasebe , Seiji Shika , Yoshinori Mabuchi , Yoshihiro Kato
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2011-155983 20110714
- 国际申请: PCT/JP2012/066995 WO 20120703
- 主分类号: H05K1/03
- IPC分类号: H05K1/03 ; H05K1/02 ; H05K3/07 ; H05K3/02 ; H05K3/18 ; H05K3/10
摘要:
Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin.