Invention Application
US20150034477A1 FINE GRAINED, NON BANDED, REFRACTORY METAL SPUTTERING TARGETS WITH A UNIFORMLY RANDOM CRYSTALLOGRAPHIC ORIENTATION, METHOD FOR MAKING SUCH FILM, AND THIN FILM BASED DEVICES AND PRODUCTS MADE THEREFROM
有权
精细粒度，非带状，具有均匀的随机晶体取向的耐火金属溅射靶，制造这种膜的方法以及薄膜的器件及其制造的产品
- Patent Title: FINE GRAINED, NON BANDED, REFRACTORY METAL SPUTTERING TARGETS WITH A UNIFORMLY RANDOM CRYSTALLOGRAPHIC ORIENTATION, METHOD FOR MAKING SUCH FILM, AND THIN FILM BASED DEVICES AND PRODUCTS MADE THEREFROM
- Patent Title (中): 精细粒度，非带状，具有均匀的随机晶体取向的耐火金属溅射靶，制造这种膜的方法以及薄膜的器件及其制造的产品
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Application No.: US14482251Application Date: 2014-09-10
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Publication No.: US20150034477A1Publication Date: 2015-02-05
- Inventor: Steven A. Miller , Prabhat Kumar , Richard Wu , Shuwei Sun , Stefan Zimmermann , Olaf Schmidt-Park
- Applicant: H.C. Starck, Inc.
- Main IPC: C23C14/34
- IPC: C23C14/34 ; C23C14/14 ; H01J37/34 ; C23C14/00
Abstract:
In various embodiments, a sputtering target initially formed by ingot metallurgy or powder metallurgy and rejuvenated by, e.g., cold spray, is utilized in sputtering processes to produce metallic thin films.
Public/Granted literature
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