Invention Application
- Patent Title: SUSCEPTOR HEATER AND METHOD OF HEATING A SUBSTRATE
- Patent Title (中): SUSCEPTOR加热器和加热基材的方法
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Application No.: US14563044Application Date: 2014-12-08
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Publication No.: US20150096973A1Publication Date: 2015-04-09
- Inventor: Todd Dunn , Fred Alokozai , Jerry Winkler , Michael Halpin
- Applicant: ASM IP Holding B.V.
- Main IPC: H01L21/67
- IPC: H01L21/67 ; F28D15/00 ; H01L21/687
Abstract:
A wafer processing apparatus may include a susceptor having a top side and a backside, a susceptor heater having a spacing member and a heating member, a shim removably mounted between the susceptor and the susceptor heater, a cavity formed by the susceptor backside, the susceptor heater, and the shim, a fluid inlet communicating with the cavity, and a plurality of fluid outlets communicating with the cavity.
Public/Granted literature
- US09299595B2 Susceptor heater and method of heating a substrate Public/Granted day:2016-03-29
Information query
IPC分类:
