发明申请
- 专利标题： POLISHING SYSTEM WITH LOCAL AREA RATE CONTROL
- 专利标题（中）： 具有局部区域速率控制的抛光系统
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申请号： US14502731申请日： 2014-09-30
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公开(公告)号： US20150111478A1公开(公告)日： 2015-04-23
- 发明人: Chih Hung CHEN , Paul D. BUTTERFIELD , Shou-Sung CHANG
- 申请人： Applied Materials, Inc.
- 主分类号： B24B37/10
- IPC分类号： B24B37/10 ; B24B7/22 ; H01L21/306 ; B24B53/017
摘要：
A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pads positioned about the perimeter of the chuck, wherein each of the one or more polishing pads are movable in a sweep pattern adjacent the substrate receiving surface of the chuck and are limited in radial movement to about less than one-half of the radius of the chuck measured from the perimeter of the chuck.
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