公开(公告)号：US20150111478A1

公开(公告)日：2015-04-23

申请号：US14502731

申请日：2014-09-30

Applicant: Applied Materials, Inc.

Inventor： Chih Hung CHEN ,  Paul D. BUTTERFIELD ,  Shou-Sung CHANG

IPC: B24B37/10 ,  B24B7/22 ,  H01L21/306 ,  B24B53/017

CPC classification number: B24B37/10 ,  B24B7/228 ,  B24B53/017

Abstract: A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pads positioned about the perimeter of the chuck, wherein each of the one or more polishing pads are movable in a sweep pattern adjacent the substrate receiving surface of the chuck and are limited in radial movement to about less than one-half of the radius of the chuck measured from the perimeter of the chuck.

Abstract translation: 一种抛光模块，包括具有基板接收表面和周边的卡盘以及围绕卡盘的周边定位的一个或多个抛光垫，其中所述一个或多个抛光垫中的每一个可以以邻近基板接收表面的扫描图案移动 卡盘并且被限制在径向运动中，大约小于从卡盘的周边测量的卡盘的半径的一半。

公开(公告)号：US20150105005A1

公开(公告)日：2015-04-16

申请号：US14510195

申请日：2014-10-09

Applicant: Applied Materials, Inc.

Inventor： Steven M. ZUNIGA ,  Chih Hung CHEN ,  Jay GURUSAMY

IPC: H01L21/677 ,  B24B37/10 ,  B24B37/34

CPC classification number: B24B37/10 ,  B24B37/345

Abstract: A chemical mechanical polishing system is provided. The chemical mechanical polishing system includes a platen, a load cup, a hub, a first polishing arm cantilevered from the hub and rotatable around the centerline of the hub between the platen and load cup, and a second polishing arm cantilevered from the hub and rotatable around the centerline of the hub between the platen and load cup the second arm rotatable independently from the hub.

Abstract translation: 提供化学机械抛光系统。 所述化学机械抛光系统包括压板，负载杯，轮毂，从所述轮毂悬臂并能围绕所述压板和所述负载杯之间的所述轮毂的中心线旋转的第一抛光臂，以及从所述轮毂悬臂的第二抛光臂， 围绕压板和负载杯之间的毂的中心线，第二臂可独立于轮毂旋转。

公开(公告)号：US20160005618A1

公开(公告)日：2016-01-07

申请号：US14476991

申请日：2014-09-04

Applicant: Applied Materials, Inc.

Inventor： Chih Hung CHEN ,  Jay GURUSAMY ,  Steven M. ZUNIGA

IPC: H01L21/306 ,  B24B41/047 ,  H01L21/67 ,  B24B37/10

CPC classification number: B24B41/047 ,  B24B37/10

Abstract: A polishing device includes a housing, a flexible base coupled to the housing, and a contact region disposed on a first side of the flexible base, wherein the flexible base expands and contracts based on pressure contained within the housing and a second side of the flexible base to form a contact area on the first side that is less than a surface area of the flexible base.

Abstract translation: 抛光装置包括壳体，联接到壳体的柔性基座和设置在柔性基座的第一侧面上的接触区域，其中柔性基座基于容纳在壳体内的压力而膨胀和收缩，并且柔性基座的第二侧 以在第一侧上形成小于柔性基底的表面积的接触区域。