公开(公告)号：US20160016283A1

公开(公告)日：2016-01-21

申请号：US14530163

申请日：2014-10-31

申请人： Applied Materials, Inc.

发明人： Paul D. BUTTERFIELD ,  Shou-Sung CHANG ,  Bum Jick KIM

IPC分类号： B24B53/017

CPC分类号： B24B53/017

摘要： Vacuum cleaning systems and related methods are disclosed. A polishing pad in combination with a fluid, such as a slurry, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system includes an enclosure body having an inlet opening which may be placed proximate to the polishing pad and an exit opening in communication with a vacuum source to remove the debris and the fluid from the polishing pad through a passageway connecting the inlet and exit openings. By including contact members secured to the enclosure body and configured to form an abutment against a working surface of the polishing pad, a Venturi effect zone between the enclosure body and the working surface of the polishing pad may be created to dislodge fluid and debris from the working surface. In this manner, scratches and contamination are avoided for later-polished substrates.

摘要翻译： 公开了真空清洁系统及相关方法。 与诸如浆料的流体结合的抛光垫与衬底接触以在其表面平坦化材料并且导致碎屑。 清洁系统包括具有可以靠近抛光垫设置的入口开口的外壳主体和与真空源连通的出口，以通过连接入口和出口的通道从抛光垫移除碎屑和流体 。 通过包括固定到外壳主体并被配置为形成与抛光垫的工作表面的抵接件的接触构件，可以产生外壳主体和抛光垫的工作表面之间的文丘里效应区，以将流体和碎屑从 工作面 以这种方式，可以避免稍后抛光的基材产生划伤和污染。

公开(公告)号：US20240042571A1

公开(公告)日：2024-02-08

申请号：US18381223

申请日：2023-10-18

申请人： Applied Materials, Inc.

发明人： Chih Chung CHOU ,  Anand Nilakantan IYER ,  Ekaterina A. MIKHAYLICHENKO ,  Christopher Heung-Gyun LEE ,  Erik RONDUM ,  Tiffany Yu-nung CHEUNG ,  Shou-Sung CHANG

IPC分类号： B24B37/04 ,  H01L21/306

CPC分类号： B24B37/042 ,  H01L21/30625

摘要： Methods and apparatuses for dispensing polishing fluids onto a polishing pad within a chemical mechanical polishing (CMP) system are disclosed herein. In particular, embodiments herein relate to a CMP apparatus for processing a substrate including a pad disposed on a platen. The pad has a pad radius and a central axis from which the pad radius extends. The apparatus also include a carrier assembly configured to be disposed on a surface of the pad and having a carrier radius that extends from a rotational axis of the carrier assembly and a fluid delivery assembly comprising one or more nozzles, each nozzle coupled to a fast actuating valve.

公开(公告)号：US20220216074A1

公开(公告)日：2022-07-07

申请号：US17141622

申请日：2021-01-05

申请人： Applied Materials, Inc.

发明人： Jianshe TANG ,  Wei LU ,  Haosheng WU ,  Taketo SEKINE ,  Shou-Sung CHANG ,  Hari N. SOUNDARARAJAN ,  Chad POLLARD

IPC分类号： H01L21/67 ,  H01L21/02 ,  B08B3/02 ,  B08B3/08 ,  B08B5/02 ,  B08B3/12 ,  H01L21/306

摘要： The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.

公开(公告)号：US20240066664A1

公开(公告)日：2024-02-29

申请号：US18363545

申请日：2023-08-01

申请人： Applied Materials, Inc.

发明人： Shou-Sung CHANG ,  Hui CHEN ,  Haosheng WU ,  Jianshe TANG ,  Sidney P. HUEY ,  Jeonghoon OH ,  Chad POLLARD ,  Chih Chung CHOU ,  Sameer A. DESHPANDE

IPC分类号： B24B53/017 ,  B08B3/02 ,  B08B5/04 ,  B24B57/02

CPC分类号： B24B53/017 ,  B08B3/02 ,  B08B5/04 ,  B24B57/02

摘要： The present disclosure relates to a pad surface cleaning system to be used with a conditioning module to condition a polishing surface of a polishing pad. The pad surface cleaning system may be used to spray the polishing surface with a high-pressure fluid spray to loosen debris from the polishing surface. The pad surface cleaning system may also be used to remove the loosened debris. Further, the pad surface cleaning system may isolate a conditioning disk from a polishing fluid to protect the conditioning disk from reacting with the polishing fluid.

公开(公告)号：US20230335418A1

公开(公告)日：2023-10-19

申请号：US18213717

申请日：2023-06-23

申请人： Applied Materials, Inc.

发明人： Jianshe TANG ,  Wei LU ,  Haosheng WU ,  Taketo SEKINE ,  Shou-Sung CHANG ,  Hari N. SOUNDARARAJAN ,  Chad POLLARD

IPC分类号： H01L21/67 ,  B08B3/02 ,  H01L21/306 ,  B08B3/12 ,  B08B3/08 ,  H01L21/02 ,  B08B5/02

CPC分类号： H01L21/67051 ,  B08B3/024 ,  H01L21/30625 ,  B08B3/12 ,  B08B3/08 ,  H01L21/02057 ,  B08B5/02 ,  B08B2230/01 ,  B08B2203/007 ,  H01L21/67109 ,  H01L21/02074

摘要： The present disclosure relates to a method and apparatus for cleaning a substrate. The method includes rotating a substrate disposed on a substrate support and spraying a front side of the substrate using steam through a front side nozzle assembly. A back side of the substrate is sprayed using steam through a back side dispenser assembly. A heated chemical is dispensed over the front side of the substrate.

公开(公告)号：US20160114459A1

公开(公告)日：2016-04-28

申请号：US14523482

申请日：2014-10-24

申请人： Applied Materials, Inc.

发明人： Paul D. BUTTERFIELD ,  Shou-Sung CHANG ,  Bum Jick KIM

IPC分类号： B24B53/017

CPC分类号： B24B53/017 ,  B24B1/00 ,  B24B53/02

摘要： Polishing pad cleaning systems employing fluid outlets orientated to direct fluid under spray bodies and towards inlet ports, and related methods are disclosed. A polishing pad in combination with slurry contacts a substrate to planarize a surface of the substrate and remove substrate defects while creating debris. A spray system removes the debris from the polishing pad to prevent substrate damage and improve efficiency. By directing fluid under a spray body to the polishing pad and towards an inlet port, the debris may be entrained in the fluid and directed to an inner plenum of the spray body. The fluid-entrained debris is subsequently removed from the inner plenum through an outlet port. In this manner, the debris removal may reduce substrate defects, improve facility cleanliness, and improve pad efficiency.

摘要翻译： 公开了使用流体出口的抛光垫清洁系统，其方向为将流体引导到喷雾体和朝向入口端口，并且相关方法。 与浆料组合的抛光垫与基底接触以平坦化基底的表面并消除基底缺陷同时产生碎片。 喷雾系统从抛光垫上除去碎屑，​​以防止基材损坏并提高效率。 通过将流体在喷雾体下方引导到抛光垫并且朝向入口端口，碎屑可能被夹带在流体中并被引导到喷雾体的内部增压室。 流体夹带的碎屑随后通过出口端口从内部增压室移除。 以这种方式，碎屑去除可以减少衬底缺陷，提高设备清洁度并提高衬垫效率。

公开(公告)号：US20150111478A1

公开(公告)日：2015-04-23

申请号：US14502731

申请日：2014-09-30

申请人： Applied Materials, Inc.

发明人： Chih Hung CHEN ,  Paul D. BUTTERFIELD ,  Shou-Sung CHANG

IPC分类号： B24B37/10 ,  B24B7/22 ,  H01L21/306 ,  B24B53/017

CPC分类号： B24B37/10 ,  B24B7/228 ,  B24B53/017

摘要： A polishing module including a chuck having a substrate receiving surface and a perimeter, and one or more polishing pads positioned about the perimeter of the chuck, wherein each of the one or more polishing pads are movable in a sweep pattern adjacent the substrate receiving surface of the chuck and are limited in radial movement to about less than one-half of the radius of the chuck measured from the perimeter of the chuck.

摘要翻译： 一种抛光模块，包括具有基板接收表面和周边的卡盘以及围绕卡盘的周边定位的一个或多个抛光垫，其中所述一个或多个抛光垫中的每一个可以以邻近基板接收表面的扫描图案移动 卡盘并且被限制在径向运动中，大约小于从卡盘的周边测量的卡盘的半径的一半。