Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US14528724Application Date: 2014-10-30
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Publication No.: US20150130009A1Publication Date: 2015-05-14
- Inventor: Katsumi EIKYU , Atsushi SAKAI , Hiroyuki ARIE
- Applicant: RENESAS ELECTRONICS CORPORATION
- Priority: JP2013-232371 20131108
- Main IPC: H01L27/146
- IPC: H01L27/146 ; H01L31/18 ; H01L31/028

Abstract:
To provide a semiconductor device having a photoelectric conversion element having a high sensitivity, causing less blooming, and capable of providing a highly reliable image. The semiconductor device has a semiconductor substrate, a first p type epitaxial layer, a second p type epitaxial layer, and a first photoelectric conversion element. The first p type epitaxial layer is formed over the main surface of the semiconductor substrate. The second p type epitaxial layer is formed so as to cover the upper surface of the first p type epitaxial layer. The first photoelectric conversion element is formed in the second p type epitaxial layer. The first and second p type epitaxial layers are each made of silicon and the first p type epitaxial layer has a p type impurity concentration higher than that of the second p type epitaxial layer.
Public/Granted literature
- US09437644B2 Semiconductor device and method of manufacturing same Public/Granted day:2016-09-06
Information query
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