发明申请
- 专利标题： ALUMINUM COATED COPPER BOND WIRE AND METHOD OF MAKING THE SAME
- 专利标题（中）： 铝镀铜铜线及其制造方法
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申请号： US14399351申请日： 2013-05-07
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公开(公告)号： US20150155252A1公开(公告)日： 2015-06-04
- 发明人: Eugen Milke , Peter Prenosil , Sven Thomas
- 申请人： Heraeus Materials Technology GmbH & Co. KG
- 申请人地址： DE Hanau
- 专利权人： Heraeus Materials Technology GmbH & Co. KG
- 当前专利权人： Heraeus Materials Technology GmbH & Co. KG
- 当前专利权人地址： DE Hanau
- 优先权： EP12003604.1 20120507
- 国际申请： PCT/EP2013/059520 WO 20130507
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; B21F9/00 ; C22C21/00 ; C22F1/08 ; C22F1/04 ; C22C9/00 ; B32B15/01 ; B23K1/00
摘要：
A wire, preferably a bonding wire for bonding in microelectronics, contains a copper core with a surface and coating layer containing aluminum superimposed over the surface of the copper core. The ratio of the thickness of the coating layer to the diameter of the copper core is from 0.05 to 0.2 μm. The wire has a diameter in the range of from 100 μm to 600 μm and specified standard deviations of the diameter of the copper core and of the thickness of the coating layer. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.
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