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公开(公告)号：US09214444B2
公开(公告)日：2015-12-15
申请号：US14399003
申请日：2013-05-07
发明人： Eugen Milke , Peter Prenosil , Sven Thomas
CPC分类号： H01L24/48 , B21C1/003 , B21C9/00 , B32B15/01 , H01B1/023 , H01B1/026 , H01L24/43 , H01L24/45 , H01L24/85 , H01L25/072 , H01L25/165 , H01L2224/43 , H01L2224/4321 , H01L2224/4382 , H01L2224/43848 , H01L2224/45014 , H01L2224/45015 , H01L2224/45033 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45624 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/4569 , H01L2224/48091 , H01L2224/48106 , H01L2224/48137 , H01L2224/48227 , H01L2224/4847 , H01L2224/85051 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/00015 , H01L2924/01006 , H01L2924/01015 , H01L2924/01047 , H01L2924/01322 , H01L2924/1203 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/14 , H01L2924/16151 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/207 , H01L2924/2075 , Y10T29/49117 , Y10T428/1275 , H01L2924/01028 , H01L2924/01014 , H01L2924/01012 , H01L2924/01008 , H01L2924/01205 , H01L2924/01204 , H01L2924/01203 , H01L2924/01201 , H01L2924/01206 , H01L2924/00 , H01L2924/013 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2224/05599 , H01L2924/00013 , H01L2924/01049
摘要： A ribbon, preferably a bonding ribbon for bonding in microelectronics, contains a first layer containing copper, a coating layer containing aluminum superimposed over the first layer, and an intermediate layer. In a cross-sectional view of the ribbon, the area share of the first layer is from 50 to 96% and the aspect ratio between the width and the height of the ribbon in a cross-sectional view is from 0.03 to less than 0.8. The ribbon has a cross-sectional area of 25,000 μm2 to 800,000 μm2. The intermediate layer contains at least one intermetallic phase containing materials of the first and coating layers. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing the wire, to a propelled device comprising said electric device and to a process of connecting two elements through the wire by wedge-bonding.
摘要翻译： 带，优选用于在微电子学中结合的粘合带包含含有铜的第一层，包含叠加在第一层上的铝的涂层和中间层。 在带的横截面视图中，第一层的面积份额为50至96％，横截面视图中的带的宽度和高度之间的纵横比为0.03至小于0.8。 带的截面积为25,000μm2至800,000μm2。 中间层含有至少一种包含第一层和涂层的材料的金属间相。 本发明还涉及一种用于将由该工艺获得的线材制成的线材制造到包含该线材的电气装置的方法，该方法包括所述电气装置的推进装置以及通过楔形连接器将两个元件通过导线连接的过程， 粘接。
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公开(公告)号：US09966355B2
公开(公告)日：2018-05-08
申请号：US14399351
申请日：2013-05-07
发明人： Eugen Milke , Peter Prenosil , Sven Thomas
IPC分类号： B32B15/01 , B21F9/00 , B23K1/00 , C22C9/00 , C22C21/00 , H01L23/00 , H01B1/02 , C22F1/04 , C22F1/08
CPC分类号： H01L24/45 , B21F9/005 , B23K1/0016 , B32B15/01 , C22C9/00 , C22C21/00 , C22F1/04 , C22F1/08 , H01B1/023 , H01B1/026 , H01L24/43 , H01L24/48 , H01L24/85 , H01L2224/4312 , H01L2224/43125 , H01L2224/43848 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45541 , H01L2224/45565 , H01L2224/45617 , H01L2224/45624 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/4823 , H01L2224/48247 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/85205 , H01L2224/85424 , H01L2224/859 , H01L2924/00011 , H01L2924/00015 , H01L2924/01015 , H01L2924/01047 , H01L2924/01322 , H01L2924/1203 , H01L2924/12041 , H01L2924/12043 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/2076 , Y10T428/1275 , H01L2924/00014 , H01L2924/01201 , H01L2924/01012 , H01L2924/01014 , H01L2924/01028 , H01L2924/01205 , H01L2924/00 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2224/45139 , H01L2924/00012 , H01L2924/01049 , H01L2924/01006
摘要： A wire, preferably a bonding wire for bonding in microelectronics, contains a copper core with a surface and coating layer containing aluminum superimposed over the surface of the copper core. The ratio of the thickness of the coating layer to the diameter of the copper core is from 0.05 to 0.2 μm. The wire has a diameter in the range of from 100 μm to 600 μm and specified standard deviations of the diameter of the copper core and of the thickness of the coating layer. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.
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公开(公告)号：US20150155252A1
公开(公告)日：2015-06-04
申请号：US14399351
申请日：2013-05-07
发明人： Eugen Milke , Peter Prenosil , Sven Thomas
CPC分类号： H01L24/45 , B21F9/005 , B23K1/0016 , B32B15/01 , C22C9/00 , C22C21/00 , C22F1/04 , C22F1/08 , H01B1/023 , H01B1/026 , H01L24/43 , H01L24/48 , H01L24/85 , H01L2224/4312 , H01L2224/43125 , H01L2224/43848 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45541 , H01L2224/45565 , H01L2224/45617 , H01L2224/45624 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/4823 , H01L2224/48247 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/85205 , H01L2224/85424 , H01L2224/859 , H01L2924/00011 , H01L2924/00015 , H01L2924/01015 , H01L2924/01047 , H01L2924/01322 , H01L2924/1203 , H01L2924/12041 , H01L2924/12043 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/2076 , Y10T428/1275 , H01L2924/00014 , H01L2924/01201 , H01L2924/01012 , H01L2924/01014 , H01L2924/01028 , H01L2924/01205 , H01L2924/00 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2224/45139 , H01L2924/00012 , H01L2924/01049 , H01L2924/01006
摘要： A wire, preferably a bonding wire for bonding in microelectronics, contains a copper core with a surface and coating layer containing aluminum superimposed over the surface of the copper core. The ratio of the thickness of the coating layer to the diameter of the copper core is from 0.05 to 0.2 μm. The wire has a diameter in the range of from 100 μm to 600 μm and specified standard deviations of the diameter of the copper core and of the thickness of the coating layer. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.
摘要翻译： 电线，优选用于在微电子学中接合的接合线包含铜芯，其表面和包含铝的涂层叠加在铜芯的表面上。 涂层的厚度与铜芯的直径之比为0.05〜0.2μm。 线材的直径在100μm至600μm的范围内，铜芯直径和涂层厚度的特定标准偏差。 本发明还涉及一种将通过该方法获得的线材的线材制造成包含至少两个元件和电线的电气设备到包含电气设备的推进设备的方法，以及连接两个元件的过程 通过电线通过楔形键合。
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公开(公告)号：US20150137390A1
公开(公告)日：2015-05-21
申请号：US14399003
申请日：2013-05-07
发明人： Eugen Milke , Peter Prenosil , Sven Thomas
CPC分类号： H01L24/48 , B21C1/003 , B21C9/00 , B32B15/01 , H01B1/023 , H01B1/026 , H01L24/43 , H01L24/45 , H01L24/85 , H01L25/072 , H01L25/165 , H01L2224/43 , H01L2224/4321 , H01L2224/4382 , H01L2224/43848 , H01L2224/45014 , H01L2224/45015 , H01L2224/45033 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45624 , H01L2224/45644 , H01L2224/45664 , H01L2224/45669 , H01L2224/4569 , H01L2224/48091 , H01L2224/48106 , H01L2224/48137 , H01L2224/48227 , H01L2224/4847 , H01L2224/85051 , H01L2224/85205 , H01L2924/00011 , H01L2924/00014 , H01L2924/00015 , H01L2924/01006 , H01L2924/01015 , H01L2924/01047 , H01L2924/01322 , H01L2924/1203 , H01L2924/12041 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/14 , H01L2924/16151 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/2064 , H01L2924/20641 , H01L2924/20642 , H01L2924/20643 , H01L2924/207 , H01L2924/2075 , Y10T29/49117 , Y10T428/1275 , H01L2924/01028 , H01L2924/01014 , H01L2924/01012 , H01L2924/01008 , H01L2924/01205 , H01L2924/01204 , H01L2924/01203 , H01L2924/01201 , H01L2924/01206 , H01L2924/00 , H01L2924/013 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2224/05599 , H01L2924/00013 , H01L2924/01049
摘要： A ribbon, preferably a bonding ribbon for bonding in microelectronics, contains a first layer containing copper, a coating layer containing aluminum superimposed over the first layer, and an intermediate layer. In a cross-sectional view of the ribbon, the area share of the first layer is from 50 to 96% and the aspect ratio between the width and the height of the ribbon in a cross-sectional view is from 0.03 to less than 0.8. The ribbon has a cross-sectional area of 25,000 μm2 to 800,000 μm2. The intermediate layer contains at least one intermetallic phase containing materials of the first and coating layers. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing the wire, to a propelled device comprising said electric device and to a process of connecting two elements through the wire by wedge-bonding.
摘要翻译： 带，优选用于在微电子学中结合的粘合带包含含有铜的第一层，包含叠加在第一层上的铝的涂层和中间层。 在带的横截面视图中，第一层的面积份额为50至96％，横截面视图中的带的宽度和高度之间的纵横比为0.03至小于0.8。 带的截面积为25,000μm2至800,000μm2。 中间层含有至少一种包含第一层和涂层的材料的金属间相。 本发明还涉及一种用于将由该工艺获得的线材制成的线材制造到包含该线材的电气装置的方法，该方法包括所述电气装置的推进装置以及通过楔形连接器将两个元件通过导线连接的过程， 粘接。
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公开(公告)号：US20150098170A1
公开(公告)日：2015-04-09
申请号：US14399446
申请日：2013-05-07
发明人： Eugen Milke , Peter Prenosil , Sven Thomas
CPC分类号： H01B1/026 , C22F1/08 , H01B1/023 , H01B13/00 , H01B13/0016 , H01L24/43 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/43 , H01L2224/43848 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45624 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48472 , H01L2224/48624 , H01L2224/48724 , H01L2224/48824 , H01L2224/85205 , H01L2224/85424 , H01L2924/00011 , H01L2924/00015 , H01L2924/01015 , H01L2924/01047 , H01L2924/01322 , H01L2924/1203 , H01L2924/12041 , H01L2924/12043 , H01L2924/1304 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/2076 , H01L2924/01203 , H01L2924/01204 , H01L2924/01205 , H01L2924/01206 , H01L2924/00014 , H01L2924/01012 , H01L2924/01014 , H01L2924/01028 , H01L2924/00 , H01L2924/013 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/00013 , H01L2924/00012 , H01L2924/01049 , H01L2924/01006
摘要： The invention relates to a wire, preferably a bonding wire for bonding in microelectronics, containing a copper core with a surface and a coating layer containing aluminum superimposed over the surface of the core. In any cross-sectional view of the wire, the area share of the coating layer is from 20 to 50% based on the total area of the cross-section of the wire, and the aspect ratio between longest and shortest paths through the wire is from larger than 0.8 to 1.0. The wire has a diameter of from 100 μm to 600 μm. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding.
摘要翻译： 本发明涉及一种电线，优选用于在微电子学中接合的接合线，其中包含具有表面的铜芯和包含叠加在芯的表面上的铝的涂层。 在线的任何横截面图中，涂层的面积份额基于导线横截面的总面积为20-50％，并且通过导线的最长和最短路径之间的纵横比为 大于0.8至1.0。 线材的直径为100μm〜600μm。 本发明还涉及一种将通过该方法获得的线材的线材制造成包含至少两个元件和电线的电气设备到包含电气设备的推进设备的方法，以及连接两个元件的过程 通过电线通过楔形键合。
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