An electronic component test device capable of testing electronic components in a plurality of test configurations. The device includes a probe head for providing a plurality of probe contact structures to an electronic component to be tested. The device includes an interconnect board coupled to the probe head. The interconnect board includes a plurality of conductive terminals, each of a first subset of the plurality of conductive terminals is coupled to one of a group of electrical signal lines for coupling to different types of external signals. The interconnect board includes a plurality of conductive lines. Each conductive line is coupled between a corresponding one of a plurality of conductive terminals in a second subset of the plurality of conductive terminals and a terminal for coupling to one of the plurality of probe contact structures. Each conductive terminal of the second subset is couplable by an interconnector of a plurality of interconnectors to a conductive terminal of multiple conductive terminals of the first subset based on a test configuration of the device.