发明申请
- 专利标题： SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- 专利标题（中）： 半导体封装及其制造方法
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申请号： US14492556申请日： 2014-09-22
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公开(公告)号： US20150171028A1公开(公告)日： 2015-06-18
- 发明人: CHAJEA JO , Taeje CHO , YUNHYEOK IM
- 申请人： CHAJEA JO , Taeje CHO , YUNHYEOK IM
- 优先权： KR10-2013-0157323 20131217
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L21/78 ; H01L21/56 ; H01L21/52 ; H01L23/31 ; H01L23/36
摘要：
A semiconductor package is provided. At least one semiconductor chip is mounted on a package substrate. A mold layer covers the at least one semiconductor chip. The mold layer exposes a portion of a top surface of an uppermost semiconductor chip of the at least one semiconductor chip.
信息查询
IPC分类:
