发明申请
- 专利标题： PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, DRY FILM SOLDER RESIST MANUFACTURED THEREFROM, AND CIRCUIT BOARD INCLUDING THE SOLDER RESIST
- 专利标题（中）： 可热固化和热固化树脂组合物，其制造的干膜电阻器和包括焊锡电阻的电路板
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申请号： US14411843申请日： 2014-06-17
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公开(公告)号： US20150191588A1公开(公告)日： 2015-07-09
- 发明人: Byung Ju Choi , Woo Jae Jeong , Bo Yun Choi , Kwang Joo Lee , Min Su Jeong , Se Jin Ku
- 申请人： LG CHEM, LTD.
- 申请人地址： KR Seoul
- 专利权人： LG CHEM, LTD.
- 当前专利权人： LG CHEM, LTD.
- 当前专利权人地址： KR Seoul
- 优先权： KR10-2013-0068961 20130617; KR10-2014-0072906 20140616
- 国际申请： PCT/KR2014/005305 WO 20140617
- 主分类号： C08L33/08
- IPC分类号： C08L33/08
摘要：
The present invention relates to a photocurable and thermosetting resin composition, including an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, two or more kinds of spherical alumina particles having different particle diameters from each other, and an organic solvent, a dry film solder resist obtained from the resin composition, and a circuit board including the dry film solder resist.
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