Invention Application
- Patent Title: METHOD OF MANUFACTURING SEMICONDUCTOE DEVICE
- Patent Title (中): 制造半导体器件的方法
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Application No.: US14613822Application Date: 2015-02-04
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Publication No.: US20150221517A1Publication Date: 2015-08-06
- Inventor: Eun-mi Kim , Un-byoung Kang , Tae-je Cho , Jung-seok Ahn
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2014-0013321 20140205
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/768 ; H01L21/304 ; H01L21/78
Abstract:
A method of manufacturing a semiconductor device capable of thinning a semiconductor chip can be performed while preventing the semiconductor chip from being damaged. A method of manufacturing a semiconductor device includes: preparing a semiconductor substrate including a plurality of semiconductor chips, attaching the semiconductor substrate to a support substrate with an adhesive support film, removing an edge region of the semiconductor substrate together with a portion of the adhesive support film between the edge region of the semiconductor substrate and the support substrate and, thereafter, polishing the semiconductor substrate to thin the semiconductor substrate.
Information query
IPC分类:
