Invention Application
- Patent Title: SEMICONDUCTOR STRUCTURES INCLUDING LINERS COMPRISING ALUCONE AND RELATED METHODS
- Patent Title (中): 半导体结构包括包含铝的衬里和相关方法
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Application No.: US14189323Application Date: 2014-02-25
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Publication No.: US20150243709A1Publication Date: 2015-08-27
- Inventor: Zhe Song , Tuman E. Allen , Cole S. Franklin , Dan Gealy
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Main IPC: H01L27/24
- IPC: H01L27/24 ; H01L21/02 ; H01L21/28 ; H01L45/00 ; H01L27/115
Abstract:
A semiconductor device including stacked structures. The stacked structures include at least two chalcogenide materials or alternating dielectric materials and conductive materials. A liner including alucone is formed on sidewalls of the stacked structures. Methods of forming the semiconductor device are also disclosed.
Public/Granted literature
- US09484196B2 Semiconductor structures including liners comprising alucone and related methods Public/Granted day:2016-11-01
Information query
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