Invention Application
US20150260757A1 PROBE TIP STRUCTURE FOR BONDINGLESS ELECTRONIC LAPPING GUIDE CONNECTIONS 审中-公开
无连接电子接头导向连接的探头提示结构

PROBE TIP STRUCTURE FOR BONDINGLESS ELECTRONIC LAPPING GUIDE CONNECTIONS
Abstract:
A lapping system including a substrate having an air bearing surface and at least one slider, wherein each slider comprises at least one electronic lapping guide pad, and a probe card comprising at least one extending probe comprising a body member and a distal end, the probe card being movable in a direction of compression between a first position in which the distal end of a first extending probe is spaced from a top surface of one of a first electronic lapping guide pad and a second position in which the distal end of the first extending probe contacts the top surface the first electronic lapping guide pad, wherein the first extending probe is pre-loaded with a predetermined spring force in the direction of compression.
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