Invention Application
US20150260757A1 PROBE TIP STRUCTURE FOR BONDINGLESS ELECTRONIC LAPPING GUIDE CONNECTIONS
审中-公开
无连接电子接头导向连接的探头提示结构
- Patent Title: PROBE TIP STRUCTURE FOR BONDINGLESS ELECTRONIC LAPPING GUIDE CONNECTIONS
- Patent Title (中): 无连接电子接头导向连接的探头提示结构
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Application No.: US14216186Application Date: 2014-03-17
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Publication No.: US20150260757A1Publication Date: 2015-09-17
- Inventor: Leping Li , Kara L. Maytag , Saravuth Keo
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Main IPC: G01R1/073
- IPC: G01R1/073 ; G11B5/31 ; G01B7/06

Abstract:
A lapping system including a substrate having an air bearing surface and at least one slider, wherein each slider comprises at least one electronic lapping guide pad, and a probe card comprising at least one extending probe comprising a body member and a distal end, the probe card being movable in a direction of compression between a first position in which the distal end of a first extending probe is spaced from a top surface of one of a first electronic lapping guide pad and a second position in which the distal end of the first extending probe contacts the top surface the first electronic lapping guide pad, wherein the first extending probe is pre-loaded with a predetermined spring force in the direction of compression.
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