公开(公告)号：US20150260757A1

公开(公告)日：2015-09-17

申请号：US14216186

申请日：2014-03-17

Applicant: Seagate Technology LLC

Inventor： Leping Li ,  Kara L. Maytag ,  Saravuth Keo

IPC: G01R1/073 ,  G11B5/31 ,  G01B7/06

CPC classification number: G11B5/3166 ,  G11B5/3169

Abstract: A lapping system including a substrate having an air bearing surface and at least one slider, wherein each slider comprises at least one electronic lapping guide pad, and a probe card comprising at least one extending probe comprising a body member and a distal end, the probe card being movable in a direction of compression between a first position in which the distal end of a first extending probe is spaced from a top surface of one of a first electronic lapping guide pad and a second position in which the distal end of the first extending probe contacts the top surface the first electronic lapping guide pad, wherein the first extending probe is pre-loaded with a predetermined spring force in the direction of compression.

Abstract translation: 一种研磨系统，包括具有空气轴承表面的基底和至少一个滑块，其中每个滑块包括至少一个电子研磨导向垫，以及包括至少一个包括主体构件和远端的延伸探针的探针卡，探针 卡可以在第一位置和第二位置之间沿压缩方向移动，在第一位置，第一延伸探针的远端与第一电子研磨引导垫中的一个的顶表面间隔开，第二位置中第一延伸探针的远端 探针与顶表面接触第一电子研磨引导垫，其中第一延伸探针在压缩方向上预加载有预定的弹簧力。

公开(公告)号：US08767351B1

公开(公告)日：2014-07-01

申请号：US13755175

申请日：2013-01-31

Applicant: Seagate Technology LLC

Inventor： Leping Li ,  Saravuth Keo ,  Kara L. Maytag ,  Pramit P. Parikh ,  Jeff R. O'Konski ,  Mark A. Herendeen ,  Joel W. Hoehn ,  Roger L. Hipwell ,  Joe J. Schobel ,  John L. Ibele ,  Ralph Marquart ,  Edward Knutson

IPC: G11B5/48

CPC classification number: G11B5/102 ,  G11B5/3169 ,  G11B5/3173 ,  G11B5/4826 ,  G11B2005/0021 ,  H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48463 ,  H01L2224/48644 ,  H01L2224/85012 ,  H01L2224/85099 ,  H01L2224/85205 ,  H01L2924/12042 ,  H01L2924/20751 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/20306 ,  H01L2924/20307 ,  H01L2924/20308 ,  H01L2924/20309 ,  H01L2924/20752 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The presently disclosed technology describes systems and methods for attaining a ball bond using less than 1 thousandth of an inch diameter gold wire using ultrasonic bonding energy and without heating an underlying bonding pad. The ball bond allows the use of particularly small bonding pads that are particularly close to adjacent microelectronic structures that limit the use of other bonding techniques that have shallow take-off angles.

Abstract translation: 目前公开的技术描述了使用超过千分之一英寸直径的金线使用超声波接合能量并且不加热下面的焊盘来获得球接合的系统和方法。 球接合允许使用特别接近相邻微电子结构的特别小的接合焊盘，其限制了具有浅起飞角的其它接合技术的使用。

公开(公告)号：US09478237B2

公开(公告)日：2016-10-25

申请号：US14030412

申请日：2013-09-18

Applicant: Seagate Technology LLC

Inventor： Leping Li ,  Jeffrey Robert O'Konski ,  Saravuth Keo ,  Pramit P. Parikh

IPC: G01R31/00 ,  G11B5/31

CPC classification number: G11B5/3169

Abstract: A data storage device may be tested during or after manufacture by a testing device that may have at least a work piece with at least one contact pad concurrently contacting bottom and sidewall surfaces of a probe tip with a centering feature of the at least one contact pad.

Abstract translation: 数据存储装置可以在制造期间或之后由测试装置进行测试，该测试装置可以具有至少一个工件，其中至少一个接触垫同时与探针尖端的底部和侧壁表面接触，并具有至少一个接触垫的定中心特征 。

公开(公告)号：US20150077148A1

公开(公告)日：2015-03-19

申请号：US14030412

申请日：2013-09-18

Applicant: Seagate Technology LLC

Inventor： Leping Li ,  Jeffrey Robert O'Konski ,  Saravuth Keo ,  Pramit P. Parikh

IPC: G11B5/455

CPC classification number: G11B5/3169

Abstract: A data storage device may be tested during or after manufacture by a testing device that may have at least a work piece with at least one contact pad concurrently contacting bottom and sidewall surfaces of a probe tip with a centering feature of the at least one contact pad.

Abstract translation: 数据存储装置可以在制造期间或之后由测试装置进行测试，该测试装置可以具有至少一个工件，其中至少一个接触垫同时与探针尖端的底部和侧壁表面接触，并具有至少一个接触垫的定中心特征 。