Invention Application
US20150275364A1 Cyclic Spike Anneal Chemical Exposure For Low Thermal Budget Processing
审中-公开
循环尖峰退火化学暴露用于低热预算处理
- Patent Title: Cyclic Spike Anneal Chemical Exposure For Low Thermal Budget Processing
- Patent Title (中): 循环尖峰退火化学暴露用于低热预算处理
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Application No.: US14666689Application Date: 2015-03-24
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Publication No.: US20150275364A1Publication Date: 2015-10-01
- Inventor: David Thompson , Huixiong Dai , Patrick M. Martin , Timothy Michaelson , Kadthala R. Narendrnath , Robert Jan Visser , Jingjing Xu , Lin Zhang
- Applicant: Applied Materials, Inc.
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/50 ; C23C16/458
Abstract:
Provided are apparatus and methods for the sequential deposition and annealing of a film within a single processing chamber. An energy source positioned within the processing chamber in an area isolated from process gases can be used to rapidly form and decompose a film on the substrate without damaging underlying layers due to exceeding the thermal budget of the device being formed.
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