Invention Application
US20150280320A1 CHIP TO DIELECTRIC WAVEGUIDE INTERFACE FOR SUB-MILLIMETER WAVE COMMUNICATIONS LINK
审中-公开
切割到用于亚微波通信的电介质波导接口
- Patent Title: CHIP TO DIELECTRIC WAVEGUIDE INTERFACE FOR SUB-MILLIMETER WAVE COMMUNICATIONS LINK
- Patent Title (中): 切割到用于亚微波通信的电介质波导接口
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Application No.: US14734371Application Date: 2015-06-09
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Publication No.: US20150280320A1Publication Date: 2015-10-01
- Inventor: Baher S. Haroun , Marco Corsi , Siraj Akhtar , Nirmal C. Warke
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Main IPC: H01Q3/44
- IPC: H01Q3/44 ; H01Q9/04 ; H01Q3/26

Abstract:
In some developing interconnect technologies, such as chip-to-chip optical interconnect or metal waveguide interconnects, misalignment can be a serious issue. Here, however, a interconnect that uses an on-chip directional antenna (which operates in the sub-millimeter range) to form a radio frequency (RF) interconnect through a dielectric waveguide is provided. This system allows for misalignment while providing the increased communication bandwidth.
Public/Granted literature
- US09484630B2 Chip to dielectric waveguide interface for sub-millimeter wave communications link Public/Granted day:2016-11-01
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