Invention Application
US20150319852A1 PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD STRIP AND MANUFACTURING METHOD THEREOF
审中-公开
印刷电路板,印刷电路板条及其制造方法
- Patent Title: PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD STRIP AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 印刷电路板,印刷电路板条及其制造方法
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Application No.: US14470011Application Date: 2014-08-27
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Publication No.: US20150319852A1Publication Date: 2015-11-05
- Inventor: Tae Hong MIN , Yi Hyun JUNG , Suk Hyeon CHO , Young Gwan KO
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2014-0053230 20140502
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/02 ; H05K3/00 ; H05K1/14 ; H05K3/42 ; C03C15/02 ; H05K1/11

Abstract:
A printed circuit board and a manufacturing method thereof. According to one embodiment, a printed circuit board may include a core part; and a conductor pattern disposed on at least one surface of the core part, the core part includes a glass core having a side portion that is polished or thinner than a central portion of the core. According to another embodiment, a method of manufacturing the printed circuit board may include cutting a glass plate to form a glass core; and removing cracks from at least one side surface of the cut glass core.
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