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公开(公告)号：US20150061817A1
公开(公告)日：2015-03-05
申请号：US14289302
申请日：2014-05-28
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Young Min LEE , Geun Young PARK , Sang Yun LEE , Jae Sun WON , Suk Hyeon CHO , Tae Won HEO
IPC: H01F27/28
CPC classification number: H01F17/0013 , H01F17/0033 , H01F17/062
Abstract: A coil component may include: a base board having an accommodation portion disposed therein and having conductive patterns disposed within the accommodation portion; an annular core disposed in the accommodation portion; and a laminated board laminated on the base board and having conductive patterns disposed on one surface thereof. The conductive patterns of the laminated board are connected to the conductive patterns of the base board to form a coil.
Abstract translation: 线圈部件可以包括：基板，其具有设置在其中的容纳部分，并且具有布置在容纳部分内的导电图案; 设置在容纳部中的环状芯体; 以及叠层在基板上并且具有设置在其一个表面上的导电图案的层压板。 层压板的导电图案连接到基板的导电图案以形成线圈。
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公开(公告)号：US20160128186A1
公开(公告)日：2016-05-05
申请号：US14857817
申请日：2015-09-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Suk Hyeon CHO , Yong Ho BAEK , Young Gwan KO , Yoong OH , Young Kuk KO
CPC classification number: H05K1/0271 , H01L2224/16227 , H01L2224/81192 , H01L2924/15323 , H01L2924/15788 , H05K3/0052 , H05K3/386 , H05K3/429 , H05K3/4605 , H05K2201/0187 , H05K2201/0195 , H05K2201/068 , H05K2201/09536 , H05K2201/09581 , H05K2201/09827 , H05K2201/09854
Abstract: A printed circuit board includes a core part including a glass plate and resin layers disposed on an upper surface and a lower surface of the glass plate, and a wiring layer disposed on at least one of an upper portion and a lower portion of the core part. The core part includes a groove part penetrating from the upper surface to the lower surface of the glass plate while being spaced apart from a side surface of the core part by a predetermined distance.
Abstract translation: 印刷电路板包括：芯部，其包括玻璃板和设置在玻璃板的上表面和下表面上的树脂层;以及布线层，设置在芯部的上部和下部中的至少一个上 。 芯部包括从玻璃板的上表面穿透到下表面的槽部，同时与芯部的侧表面间隔预定距离。
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公开(公告)号：US20160088742A1
公开(公告)日：2016-03-24
申请号：US14848907
申请日：2015-09-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Suk Hyeon CHO , Yong Ho BAEK , Young Gwan KO , Yoong OH , Young Kuk KO
CPC classification number: H05K1/115 , H05K1/0271 , H05K3/007 , H05K3/422 , H05K3/4605 , H05K3/4608 , H05K3/4682 , H05K2201/09827
Abstract: A printed circuit board may include: a first circuit layer; a first insulating layer disposed on the first circuit layer; a high-rigidity layer disposed on the first insulating layer; and a second circuit layer disposed on the high-rigidity layer and connected to the first circuit layer by a first via extending through the first insulating layer and the high-rigidity layer, wherein a rigidity of the high-rigidity layer is greater than a rigidity of the first insulating layer.
Abstract translation: 印刷电路板可以包括：第一电路层; 布置在所述第一电路层上的第一绝缘层; 设置在所述第一绝缘层上的高刚性层; 以及第二电路层，其设置在所述高刚性层上并且通过延伸穿过所述第一绝缘层和所述高刚性层的第一通孔连接到所述第一电路层，其中所述高刚性层的刚性大于刚性 的第一绝缘层。
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公开(公告)号：US20160135289A1
公开(公告)日：2016-05-12
申请号：US14875241
申请日：2015-10-05
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Suk Hyeon CHO , Yoong OH , Young Gwan KO , Yong Ho BAEK , Young Kuk KO
CPC classification number: H05K1/0271 , H01L2224/16227 , H01L2924/15313 , H01L2924/15788 , H05K1/038 , H05K1/115 , H05K1/181 , H05K3/002 , H05K3/0029 , H05K3/0047 , H05K3/0052 , H05K3/429 , H05K3/4605 , H05K2201/0187 , H05K2201/0195 , H05K2201/0909 , H05K2201/09536 , H05K2201/09581 , H05K2201/09827 , H05K2201/09854 , H05K2201/10674
Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board include a glass plate, an insulating member penetrating through the glass plate, insulating layers disposed on a first surface and a second surface of the glass plate, and a via through the insulating member.
Abstract translation: 提供了一种印刷电路板及其制造方法。 印刷电路板包括玻璃板，穿透玻璃板的绝缘构件，设置在玻璃板的第一表面和第二表面上的绝缘层，以及通过绝缘构件的通孔。
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公开(公告)号：US20150373841A1
公开(公告)日：2015-12-24
申请号：US14746308
申请日：2015-06-22
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Suk Hyeon CHO , Yong Sam LEE , Tae Hong MIN , Young Gwan KO , Yoong OH , Joon Sung LEE
CPC classification number: H05K3/4605 , C03B33/074 , H05K1/0306 , H05K2201/09036 , H05K2201/09827 , Y10T83/0207 , Y10T428/24488
Abstract: A printed circuit board, according to one embodiment, includes: a core having a slope pattern formed on a side surface thereof; a first insulating layer laminated on the core; a second insulating layer laminated on the first insulating layer to cover the side surface of the core; an inner circuit layer and an outer circuit layer respectively formed on the first insulating layer and the second insulating layer; and a solder resist layer laminated on the second insulating layer.
Abstract translation: 根据一个实施例的印刷电路板包括：具有形成在其侧表面上的斜面图案的芯; 层叠在所述芯上的第一绝缘层; 层叠在所述第一绝缘层上以覆盖所述芯的侧表面的第二绝缘层; 分别形成在所述第一绝缘层和所述第二绝缘层上的内电路层和外电路层; 以及层叠在第二绝缘层上的阻焊层。
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Patent Agency Ranking
6.发明申请PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD STRIP AND MANUFACTURING METHOD THEREOF 审中-公开印刷电路板，印刷电路板条及其制造方法公开(公告)号：US20150319852A1
公开(公告)日：2015-11-05
申请号：US14470011
申请日：2014-08-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Yi Hyun JUNG , Suk Hyeon CHO , Young Gwan KO
CPC classification number: C03C15/02 , H01L2224/16227 , H01L2224/81192 , H01L2224/97 , H01L2924/15311 , H01L2924/15788 , H01L2924/3511 , H05K1/0298 , H05K1/0306 , H05K1/115 , H05K1/142 , H05K3/002 , H05K3/0029 , H05K3/0044 , H05K3/0052 , H05K3/42 , H05K3/4605 , H05K2201/09136 , H05K2201/09154 , H05K2201/09536 , H05K2203/1509 , H05K2203/1518 , H01L2224/81
Abstract: A printed circuit board and a manufacturing method thereof. According to one embodiment, a printed circuit board may include a core part; and a conductor pattern disposed on at least one surface of the core part, the core part includes a glass core having a side portion that is polished or thinner than a central portion of the core. According to another embodiment, a method of manufacturing the printed circuit board may include cutting a glass plate to form a glass core; and removing cracks from at least one side surface of the cut glass core.
Abstract translation: 印刷电路板及其制造方法。 根据一个实施例，印刷电路板可以包括芯部分; 以及设置在所述芯部的至少一个表面上的导体图案，所述芯部包括玻璃芯，所述玻璃芯具有被抛光或比所述芯的中心部更薄的侧部。 根据另一实施例，制造印刷电路板的方法可以包括切割玻璃板以形成玻璃芯; 并且从切割的玻璃芯的至少一个侧表面去除裂纹。
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7.发明申请COIL COMPONENT, MANUFACTURING METHOD THEREOF, COIL COMPONENT-EMBEDDED SUBSTRATE, AND VOLTAGE ADJUSTMENT MODULE HAVING THE SAME 审中-公开线圈组件及其制造方法，线圈组件嵌入式基板及其电压调整模块公开(公告)号：US20150116950A1
公开(公告)日：2015-04-30
申请号：US14524940
申请日：2014-10-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ji No YOO , Han KIM , Won Gi KIM , Suk Hyeon CHO
CPC classification number: H01F27/2804 , H01F27/022 , H01F27/255 , H05K1/116 , H05K1/185 , H05K3/46 , H05K2201/086 , H05K2201/1003 , H05K2201/10196 , Y10T29/49075
Abstract: A coil component may be capable of being easily manufactured and significantly decreasing direct current (DC) resistance of its wiring. The coil component may include a coil assembly including a core substrate and coil patterns formed on the core substrate; and a magnetic material part embedding the coil assembly therein.
Abstract translation: 线圈部件可以容易地制造并且显着降低其布线的直流（DC）电阻。 线圈部件可以包括线圈组件，其包括芯基板和形成在芯基板上的线圈图案; 以及将线圈组件嵌入其中的磁性材料部分。
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8.发明申请公开(公告)号：US20150373842A1
公开(公告)日：2015-12-24
申请号：US14521641
申请日：2014-10-23
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Hong MIN , Yi Hyun JUNG , Suk Hyeon CHO , Young Gwan KO
CPC classification number: H05K3/0097 , H01L2224/16227 , H01L2924/15313 , H01L2924/15788 , H05K1/02 , H05K3/0052 , H05K3/4605 , H05K2201/09145 , H05K2203/0228 , Y10T428/163 , Y10T428/239 , Y10T428/24339 , Y10T428/24612 , Y10T428/24777 , Y10T428/24793
Abstract: There are provided a substrate strip, a substrate panel, and a manufacturing method of a substrate strip. The substrate strip includes: a plurality of unit substrates including a glass core; and a glass core cover part disclosed on a side surface of the substrate strip on which the glass core is exposed.
Abstract translation: 提供了衬底条，衬底面板和衬底条的制造方法。 基板条包括：多个单元基板，包括玻璃芯; 以及玻璃芯覆盖部，其在基板条的侧表面上露出玻璃芯。
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9.发明申请公开(公告)号：US20150223341A1
公开(公告)日：2015-08-06
申请号：US14597795
申请日：2015-01-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Hoon KIM , Tae Hong MIN , Young Gwan KO , Hye Jin KIM , Suk Hyeon CHO , Chil Woo KWON , Jung Han LEE
CPC classification number: H05K3/007 , H01L21/568 , H01L2224/04105 , H05K1/113 , H05K1/185 , H05K3/4623 , H05K3/4682 , H05K3/4697 , Y10T29/49128 , Y10T29/4913
Abstract: An embedded board, a printed circuit board, and a method of manufacturing the same. According to one embodiment of the present invention, an embedded board includes: a core insulating layer formed with a first cavity; a first circuit layer formed on one surface of the core insulating layer; a build-up insulating layer formed on one surface of the core insulating layer and formed with a second cavity extending from the first cavity; devices disposed in the first cavity and the second cavity and formed to protrude from one surface of the core insulating layer; a first insulating layer formed on the other surface of the core insulating layer and filling the first cavity and the second cavity; and a build-up circuit layer and a via formed in the build-up insulating layer.
Abstract translation: 嵌入式电路板，印刷电路板及其制造方法。 根据本发明的一个实施例，嵌入式板包括：形成有第一腔的芯绝缘层; 形成在所述芯绝缘层的一个表面上的第一电路层; 形成在所述芯绝缘层的一个表面上且形成有从所述第一腔延伸的第二腔的积聚绝缘层; 设置在所述第一腔和所述第二腔中并且形成为从所述芯绝缘层的一个表面突出的器件; 形成在所述芯绝缘层的另一个表面上并填充所述第一腔和所述第二腔的第一绝缘层; 以及在积层绝缘层中形成的积聚电路层和通孔。
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公开(公告)号：US20150129293A1
公开(公告)日：2015-05-14
申请号：US14537998
申请日：2014-11-11
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Suk Hyeon CHO , Hyo Seung NAM , Yong Sam LEE , Seok Hwan AHN
CPC classification number: H05K1/0271 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/12042 , H01L2924/15311 , H05K3/002 , H05K3/0029 , H05K3/0047 , H05K3/0052 , H05K3/007 , H05K3/429 , H05K3/4605 , H05K3/4644 , H05K2201/017 , H05K2201/0187 , H05K2201/0195 , H05K2201/0909 , H05K2201/09136 , H05K2201/09827 , H05K2201/09881 , H05K2201/2009 , H05K2203/1536 , H01L2224/81 , H01L2924/00
Abstract: A printed circuit board and a method of manufacturing the same. In one embodiment, a printed circuit board includes: a core made of a glass material; an insulator surrounding the core; and a via connecting internal circuit layers through the core and the insulator.
Abstract translation: 印刷电路板及其制造方法。 在一个实施例中，印刷电路板包括：由玻璃材料制成的芯; 围绕芯的绝缘体; 以及通过芯和绝缘体连接内部电路层的通孔。
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