Invention Application
US20150323250A1 SUBSTRATE PROCESSING APPARATUS, DEPOSIT REMOVING METHOD OF SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM
审中-公开
基板加工装置，基板加工装置和记录介质的沉积物去除方法
- Patent Title: SUBSTRATE PROCESSING APPARATUS, DEPOSIT REMOVING METHOD OF SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM
- Patent Title (中): 基板加工装置，基板加工装置和记录介质的沉积物去除方法
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Application No.: US14707145Application Date: 2015-05-08
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Publication No.: US20150323250A1Publication Date: 2015-11-12
- Inventor: Tsuyoshi Mizuno , Yoichi Tokunaga , Hiromitsu Nanba , Tatuhiro Ueki , Fitrianto
- Applicant: Tokyo Electron Limited
- Priority: JP2014-098039 20140509
- Main IPC: F26B3/20
- IPC: F26B3/20 ; H01L21/67
Abstract:
A particle can be suppressed from being generated by removing a processing liquid or crystals caused by the processing liquid which adhere to a cover member. A substrate processing apparatus includes a substrate holding unit 3 configured to hold a substrate W; a processing liquid supply unit 7 configured to supply a processing liquid onto the substrate W held in the substrate holding unit 3; and a cover member 5 which has a ring shape and is disposed to face a peripheral portion of the substrate held in the substrate holding unit 3. Further, the cover member 5 is equipped with a heater 701 configured to heat the cover member 5.
Information query
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