公开(公告)号：US20170287699A1

公开(公告)日：2017-10-05

申请号：US15464679

申请日：2017-03-21

Applicant: Tokyo Electron Limited

Inventor： Akira Fujita ,  Tsuyoshi Mizuno

IPC: H01L21/02 ,  C23F1/32 ,  B08B3/08 ,  H01L21/687 ,  H01L21/66 ,  B08B3/04 ,  C23F1/16 ,  H01L21/67

CPC classification number: H01L21/02052 ,  B08B3/02 ,  B08B3/041 ,  B08B3/08 ,  C23F1/02 ,  C23F1/08 ,  C23F1/16 ,  C23F1/32 ,  G03F7/168 ,  H01L21/02087 ,  H01L21/67051 ,  H01L21/67253 ,  H01L21/68764 ,  H01L22/12 ,  H01L22/20

Abstract: Provided is a substrate processing apparatus that removes a film by supplying a processing liquid to the peripheral edge of a substrate. An ejection unit ejects the processing liquid to the peripheral edge of the substrate held and rotated by a substrate holding unit. An ejection position setting unit sets the ejection position of the processing liquid of the ejection unit to correspond to the removal width of the film included in a recipe, and a property information acquisition unit acquires property information of the film to be removed. A correction amount acquisition unit acquires the correction amount for correcting the ejection position of the processing liquid based on the property information of the film, and an ejection position correction unit corrects the ejection position of the processing liquid by the ejection unit based on the correction amount acquired by the correction amount acquisition unit.

公开(公告)号：US20150323250A1

公开(公告)日：2015-11-12

申请号：US14707145

申请日：2015-05-08

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Mizuno ,  Yoichi Tokunaga ,  Hiromitsu Nanba ,  Tatuhiro Ueki ,  Fitrianto

IPC: F26B3/20 ,  H01L21/67

CPC classification number: H01L21/67109 ,  F26B3/20 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/67075

Abstract: A particle can be suppressed from being generated by removing a processing liquid or crystals caused by the processing liquid which adhere to a cover member. A substrate processing apparatus includes a substrate holding unit 3 configured to hold a substrate W; a processing liquid supply unit 7 configured to supply a processing liquid onto the substrate W held in the substrate holding unit 3; and a cover member 5 which has a ring shape and is disposed to face a peripheral portion of the substrate held in the substrate holding unit 3. Further, the cover member 5 is equipped with a heater 701 configured to heat the cover member 5.

Abstract translation: 可以通过除去由附着在盖构件上的处理液引起的处理液或晶体来抑制颗粒的产生。 基板处理装置包括：基板保持单元3，被配置为保持基板W; 处理液供给单元7，被配置为将处理液体供给到保持在基板保持单元3中的基板W上; 以及具有环状并被设置为面对保持在基板保持单元3中的基板的周边部分的盖构件5.此外，盖构件5配备有构造成加热盖构件5的加热器701。

公开(公告)号：US20140251539A1

公开(公告)日：2014-09-11

申请号：US14198922

申请日：2014-03-06

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Mizuno ,  Yoichi Tokunaga ,  Hiromitsu Namba ,  Tatuhiro Ueki ,  Jun Nogami ,  Jiro Higashijima ,  Yoshifumi Amano ,  Takatoshi Miyama

IPC: H01L21/67

CPC classification number: H01L21/67051

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method configured to perform a processing of a substrate by a processing liquid, in which the processing liquid is supplied to a substrate which rotates to process the substrate. The substrate processing apparatus includes a substrate rotating unit that rotates the substrate, a processing liquid supply unit that supplies the processing liquid to the substrate, a collection cup disposed around the substrate to collect the processing liquid supplied to the substrate, and form an air stream that flows downward from an opening formed at a top of the collection cup through a periphery of an outside of the substrate, and a negative pressure generating unit which is provided at an inside of the collection cup and at an outside of the opening and generates a negative pressure which acts toward the outside of the substrate.

Abstract translation: 公开了一种基板处理装置和基板处理方法，其被配置为通过处理液体进行基板的处理，其中处理液体被供给到旋转以处理基板的基板。 基板处理装置包括使基板旋转的基板旋转单元，将处理液供给到基板的处理液供给单元，设置在基板周围的收集杯，收集供给到基板的处理液，形成空气流 从形成在收集杯顶部的开口向下流过基板外部的周边;以及负压产生单元，其设置在收集杯的内部并在开口的外侧，并产生 作用于衬底外部的负压。

公开(公告)号：US09252009B2

公开(公告)日：2016-02-02

申请号：US13846981

申请日：2013-03-19

Applicant: Tokyo Electron Limited

Inventor： Tsuyoshi Mizuno

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/02

CPC classification number: H01L21/02041 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/68792

Abstract: A liquid processing apparatus according to the present disclosure includes: a substrate holding unit configured to horizontally hold a substrate; a rotation driving unit configured to rotate the substrate holding unit about a vertical axis; a processing liquid supply unit configured to supply a processing liquid to the substrate while the substrate is being rotated; an upper guide ring and a lower guide ring which are configured to be rotated together with the substrate holding unit, to surround the substrate, to be arranged vertically to overlap each other with a gap therebetween, and to guide the processing liquid scattered from the substrate; and a rotating cup configured to be rotated together with the substrate holding unit, and to receive and downwardly guide the guided processing liquid.

Abstract translation: 根据本公开的液体处理装置包括：基板保持单元，被配置为水平地保持基板; 旋转驱动单元，其构造成使所述基板保持单元绕垂直轴旋转; 处理液供给单元，其构造成在所述基板旋转的同时将处理液供给到所述基板; 上引导环和下引导环，其构造成与基板保持单元一起旋转，以围绕基板，以垂直方式彼此重叠地间隔开间隙，并引导从基板散射的处理液体 ; 以及旋转杯，其构造成与所述基板保持单元一起旋转，并且接收并向下引导所引导的处理液。

公开(公告)号：US20130269737A1

公开(公告)日：2013-10-17

申请号：US13846981

申请日：2013-03-19

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tsuyoshi Mizuno

IPC: H01L21/02

CPC classification number: H01L21/02041 ,  H01L21/67028 ,  H01L21/67051 ,  H01L21/68792

Abstract: A liquid processing apparatus according to the present disclosure includes: a substrate holding unit configured to horizontally hold a substrate; a rotation driving unit configured to rotate the substrate holding unit about a vertical axis; a processing liquid supply unit configured to supply a processing liquid to the substrate while the substrate is being rotated; an upper guide ring and a lower guide ring which are configured to be rotated together with the substrate holding unit, to surround the substrate, to be arranged vertically to overlap each other with a gap therebetween, and to guide the processing liquid scattered from the substrate; and a rotating cup configured to be rotated together with the substrate holding unit, and to receive and downwardly guide the guided processing liquid.

Abstract translation: 根据本公开的液体处理装置包括：基板保持单元，被配置为水平地保持基板; 旋转驱动单元，其构造成使所述基板保持单元绕垂直轴旋转; 处理液供给单元，其构造成在所述基板旋转的同时将处理液供给到所述基板; 上引导环和下引导环，其构造成与基板保持单元一起旋转，以围绕基板，以垂直方式彼此重叠地间隔开间隙，并引导从基板散射的处理液体 ; 以及旋转杯，其构造成与所述基板保持单元一起旋转，并且接收并向下引导所引导的处理液。