Invention Application
- Patent Title: DIRECT LIFT PROCESS APPARATUS
- Patent Title (中): 直接提升过程设备
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Application No.: US14730192Application Date: 2015-06-03
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Publication No.: US20150364347A1Publication Date: 2015-12-17
- Inventor: Khiem NGUYEN , Saravjeet SINGH , Amitabh SABHARWAL
- Applicant: Applied Materials, Inc.
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/677 ; H01L21/687
Abstract:
The present disclosure provides a substrate support assembly includes a substrate pedestal having an upper surface for receiving and supporting a substrate, a cover plate disposed on the substrate support pedestal, and two or more lift pins movably disposed through the substrate support pedestal and the cover plate. The cover plate includes a disk body having a central opening. The two or more lift pins are self supportive. Each of the two or more lift pins comprises one or more contact pads, and the contact pads of the lift pins extend into to the central opening of the cover plate to receive and support a substrate at an edge region of the substrate.
Public/Granted literature
- US09978632B2 Direct lift process apparatus Public/Granted day:2018-05-22
Information query
IPC分类:
