Invention Application
- Patent Title: Vacuum Chuck with Polymeric Embossments
- Patent Title (中): 真空卡盘与聚合压花
-
Application No.: US14764436Application Date: 2014-02-11
-
Publication No.: US20150380294A1Publication Date: 2015-12-31
- Inventor: John Glasko , Richard A. Cooke , I-Kuan Lin
- Applicant: ENTEGRIS, INC.
- International Application: PCT/US2014/015735 WO 20140211
- Main IPC: H01L21/683
- IPC: H01L21/683
Abstract:
A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.
Public/Granted literature
- US10734270B2 Vacuum chuck with polymeric embossments Public/Granted day:2020-08-04
Information query
IPC分类:
