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公开(公告)号：US11713504B2
公开(公告)日：2023-08-01
申请号：US17840367
申请日：2022-06-14
Applicant: ENTEGRIS, INC.
Inventor： I-Kuan Lin , Carlo Waldfried , Chandrasekaran Venkatraman
IPC: C23C16/40 , C23C16/455 , C23C16/44
CPC classification number: C23C16/405 , C23C16/403 , C23C16/4404 , C23C16/45529 , C23C16/45553
Abstract: Described are multi-layer coatings, substrates (i.e., articles) coated with a multi-layer coating, and methods of preparing a multi-layer coating by atomic layer deposition, wherein the coating includes layers alumina and yttria.
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2.发明申请公开(公告)号：US20180044800A1
公开(公告)日：2018-02-15
申请号：US15550630
申请日：2016-02-13
Applicant: Entegris, Inc.
Inventor： Bryan C. Hendrix , David W. Peters , Weimin Li , Carlo Waldfried , Richard A. Cooke , Nilesh Gunda , I-Kuan Lin
IPC: C23C28/04 , C23C16/40 , C23C16/455 , C23C14/24 , C23C14/50
CPC classification number: C23C28/044 , C23C14/243 , C23C14/50 , C23C16/042 , C23C16/403 , C23C16/404 , C23C16/405 , C23C16/4404 , C23C16/4412 , C23C16/45525 , C23C16/45555 , C23C16/56 , C23C28/042
Abstract: Coatings applicable to a variety of substrate articles, structures, materials, and equipment are described. In various applications, the substrate includes metal surface susceptible to formation of oxide, nitride, fluoride, or chloride of such metal thereon, wherein the metal surface is configured to be contacted in use with gas, solid, or liquid that is reactive therewith to form a reaction product that is deleterious to the substrate article, structure, material, or equipment. The metal surface is coated with a protective coating preventing reaction of the coated surface with the reactive gas, and/or otherwise improving the electrical, chemical, thermal, or structural properties of the substrate article or equipment. Various methods of coating the metal surface are described, and for selecting the coating material that is utilized.
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3.发明授权公开(公告)号：US12084778B2
公开(公告)日：2024-09-10
申请号：US16898149
申请日：2020-06-10
Applicant: Entegris, Inc.
Inventor： Bryan C. Hendrix , David W. Peters , Weimin Li , Carlo Waldfried , Richard A. Cooke , Nilesh Gunda , I-Kuan Lin
IPC: C23C28/04 , B01D39/20 , B01D67/00 , C23C14/24 , C23C14/50 , C23C16/04 , C23C16/40 , C23C16/44 , C23C16/455 , C23C16/56
CPC classification number: C23C28/044 , B01D39/2027 , B01D67/00 , C23C14/243 , C23C14/50 , C23C16/042 , C23C16/403 , C23C16/404 , C23C16/405 , C23C16/4404 , C23C16/4412 , C23C16/45525 , C23C16/45555 , C23C16/56 , C23C28/042 , B01D2239/0478 , B01D2239/1216
Abstract: Coatings applicable to a variety of substrate articles, structures, materials, and equipment are described. In various applications, the substrate includes metal surface susceptible to formation of oxide, nitride, fluoride, or chloride of such metal thereon, wherein the metal surface is configured to be contacted in use with gas, solid, or liquid that is reactive therewith to form a reaction product that is deleterious to the substrate article, structure, material, or equipment. The metal surface is coated with a protective coating preventing reaction of the coated surface with the reactive gas, and/or otherwise improving the electrical, chemical, thermal, or structural properties of the substrate article or equipment. Various methods of coating the metal surface are described, and for selecting the coating material that is utilized.
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公开(公告)号：US20190067069A1
公开(公告)日：2019-02-28
申请号：US16073648
申请日：2017-02-02
Applicant: ENTEGRIS, Inc.
Inventor： John Michael Glasko , I-Kuan Lin , Carlo Waldfried
IPC: H01L21/683
Abstract: An electrostatic chuck with a generally non-arcuate top surface shaped protrusions that has edge surfaces similar to a portion of a ellipse. The structure of the protrusions leads to the reduction of particulate material generated by interaction between the supported substrate and chuck. Reduced levels of scratching, abrasion, wear and particulate generation are achieved by improved smoothing and flattening of the protrusion surface.
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公开(公告)号：US20150380294A1
公开(公告)日：2015-12-31
申请号：US14764436
申请日：2014-02-11
Applicant: ENTEGRIS, INC.
Inventor： John Glasko , Richard A. Cooke , I-Kuan Lin
IPC: H01L21/683
Abstract: A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.
Abstract translation: 公开了一种具有聚合物压花的真空吸盘。 聚合物压花形成在基底基材的表面上并且被研磨成平坦度，使得由真空吸盘夹持的晶片基底具有小于基底基底上的峰谷平坦度的峰谷平坦度。 聚合物压花的研磨适应于基底基材的平整度的变化，只要压花高到足以支撑基底基板的峰谷高度变化即可。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20150294891A1
公开(公告)日：2015-10-15
申请号：US14439464
申请日：2013-10-29
Applicant: ENTEGRIS, INC.
Inventor： I-Kuan Lin , Richard A. Cooke , Jakub Rybczynski
IPC: H01L21/683
CPC classification number: H01L21/6831 , C23C16/4581 , H01L21/6875 , H01L21/68757 , H02N13/00
Abstract: In accordance with an embodiment of the invention, there is provided a soft protrusion structure for an electrostatic chuck, which offers a non-abrasive contact surface for wafers, workpieces or other substrates, while also having improved manufacturability and compatibility with grounded surface platen designs. The soft protrusion structure comprises a photo-patternable polymer.
Abstract translation: 根据本发明的实施例，提供了一种用于静电卡盘的软突起结构，其提供用于晶片，工件或其它基板的非研磨接触表面，同时具有改进的可制造性和与接地的平台台板设计的兼容性。 软突起结构包括可光致图案的聚合物。
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公开(公告)号：US20240337023A1
公开(公告)日：2024-10-10
申请号：US18745963
申请日：2024-06-17
Applicant: ENTEGRIS, INC.
Inventor： I-Kuan Lin , Carlo Waldfried , Jianan Hou
IPC: C23C16/56 , C23C16/40 , C23C16/44 , C23C16/455
CPC classification number: C23C16/56 , C23C16/405 , C23C16/4404 , C23C16/45525
Abstract: Articles and methods relating to coatings having superior chemical resistance and structural integrity, can be prepared via atomic layer deposition and fluoro-annealing at low process temperatures of between about 150° C. and less than 300° C. The film comprises a fluorinated metal oxide containing yttrium.
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公开(公告)号：US10961617B2
公开(公告)日：2021-03-30
申请号：US14870981
申请日：2015-09-30
Applicant: Entegris, Inc.
Inventor： I-Kuan Lin , Nilesh Gunda , Dennis Radgowski , Chandra Venkatraman
Abstract: Articles and methods relating to coatings having superior plasma etch-resistance and which can prolong the life of RIE components are provided. An article has a vacuum compatible substrate and a protective film overlying at least a portion of the substrate. The film comprises a fluorinated metal oxide containing yttrium.
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公开(公告)号：US10770330B2
公开(公告)日：2020-09-08
申请号：US16073648
申请日：2017-02-02
Applicant: ENTEGRIS, Inc.
Inventor： John Michael Glasko , I-Kuan Lin , Carlo Waldfried
IPC: H01L21/683
Abstract: An electrostatic chuck with a generally non-arcuate top surface shaped protrusions that has edge surfaces similar to a portion of a ellipse. The structure of the protrusions leads to the reduction of particulate material generated by interaction between the supported substrate and chuck. Reduced levels of scratching, abrasion, wear and particulate generation are achieved by improved smoothing and flattening of the protrusion surface.
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公开(公告)号：US10734270B2
公开(公告)日：2020-08-04
申请号：US14764436
申请日：2014-02-11
Applicant: Entegris, Inc.
Inventor： John Glasko , Richard A. Cooke , I-Kuan Lin
IPC: H01L21/683 , H01L21/687
Abstract: A vacuum chuck with polymeric embossments is disclosed. The polymeric embossments are formed on the surface of a base substrate and are lapped to a flatness such that a wafer substrate clamped by the vacuum chuck has a peak to valley flatness that is less than a peak to valley flatness across the base substrate. Lapping of the polymeric embossments accommodates for variations in the flatness of the base substrate so long as the embossments are tall enough to stand over the peak to valley height variations in the base substrate.
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