Invention Application
US20150380421A1 SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME
审中-公开
半导体存储器件及其制造方法
- Patent Title: SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FABRICATING THE SAME
- Patent Title (中): 半导体存储器件及其制造方法
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Application No.: US14848423Application Date: 2015-09-09
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Publication No.: US20150380421A1Publication Date: 2015-12-31
- Inventor: Jae-Hwang SIM , Jinhyun SHIN , Jong-Min LEE
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2012-0139774 20121204
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L21/764

Abstract:
Provided are a semiconductor memory device and a method of fabricating the same. the semiconductor memory device may include a semiconductor substrate with a first trench defining active regions in a first region and a second trench provided in a second region around the first region, a gate electrode provided on the first region to cross the active regions, a charge storing pattern disposed between the gate electrode and the active regions, a blocking insulating layer provided between the gate electrode and the charge storing pattern and extending over the first trench to define a first air gap in the first trench, and an insulating pattern provided spaced apart from a bottom surface of the second trench to define a second air gap in the second trench.
Public/Granted literature
- US09379123B2 Semiconductor memory devices and methods of fabricating the same Public/Granted day:2016-06-28
Information query
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