METHOD OF FORMING A SEMICONDUCTOR DIE

Invention Application

US20160005655A1 METHOD OF FORMING A SEMICONDUCTOR DIE 有权

Title translation: 形成半导体器件的方法

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Patent Title: METHOD OF FORMING A SEMICONDUCTOR DIE
Patent Title (中): 形成半导体器件的方法
Application No.: US14849779

Application Date: 2015-09-10
Publication No.: US20160005655A1

Publication Date: 2016-01-07
Inventor: Gordon M. GRIVNA , Michael J. SEDDON
Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Applicant Address: US AZ Phoenix
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Current Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Current Assignee Address: US AZ Phoenix
Main IPC: H01L21/78
IPC: H01L21/78 ; H01L29/06 ; H01L21/3065

Abstract:

In one embodiment, semiconductor die having non-rectangular shapes and die having various different shapes are formed and singulated from a semiconductor wafer.

Abstract(Chinese):

在一个实施例中，形成具有各种不同形状的非矩形形状的半导体管芯和从半导体晶片切割的单元。

Public/Granted literature

US09437493B2 Method of forming a semiconductor die Public/Granted day:2016-09-06

Information query

Global Dossier Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）