Invention Application
- Patent Title: APPARATUS FOR TREATING SUBSTRATE
- Patent Title (中): 用于处理基板的装置
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Application No.: US14747704Application Date: 2015-06-23
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Publication No.: US20160013079A1Publication Date: 2016-01-14
- Inventor: Jung Bong CHOI , Seong Soo KIM , Chan-Young HEO , Oh Jin KWON
- Applicant: Semes Co., Ltd.
- Priority: KR10-2014-0087756 20140711
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687
Abstract:
A substrate treating apparatus is provided which includes a treating container of which a top end is opened, a substrate support unit placed in a treating container to support a substrate, a treatment solution supply unit supplying a treatment solution to a substrate put on the support unit, and a heating unit placed in the substrate support unit to heat the substrate. The heating unit includes a heating element and a reflection element reflecting a heat from the heating element upward.
Information query
IPC分类:
