Invention Application
- Patent Title: SIGNAL PATH ISOLATION FOR CONDUCTIVE CIRCUIT PATHS AND MULTIPURPOSE INTERFACES
- Patent Title (中): 导通电路信号路径隔离和多路接口
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Application No.: US14920674Application Date: 2015-10-22
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Publication No.: US20160041940A1Publication Date: 2016-02-11
- Inventor: James Spehar , Jingsong Zhou , Madan Vemula
- Applicant: NXP B.V.
- Main IPC: G06F13/40
- IPC: G06F13/40 ; H03K5/1252 ; H03K17/16 ; G06F13/42

Abstract:
A device can be configured to provide isolation between conductive circuit paths and to selectively connect one of the conductive circuit paths to a shared interface. Each conductive circuit path can include driver circuitry designed to transmit signals according to a particular protocol and a corresponding signal speed. The shared interface can be, in one instance, a connector designed for connection to other devices. The other devices can be configured to communicate over the shared interface using one or more of the particular protocols provided using the different circuit paths.
Public/Granted literature
- US10346339B2 Signal path isolation for conductive circuit paths and multipurpose interfaces Public/Granted day:2019-07-09
Information query