Invention Application
US20160043188A1 Selective Polysilicon Doping for Gate Induced Drain Leakage Improvement
审中-公开
选择性多晶硅掺杂用于栅极引起的漏极泄漏改进
- Patent Title: Selective Polysilicon Doping for Gate Induced Drain Leakage Improvement
- Patent Title (中): 选择性多晶硅掺杂用于栅极引起的漏极泄漏改进
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Application No.: US14453304Application Date: 2014-08-06
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Publication No.: US20160043188A1Publication Date: 2016-02-11
- Inventor: Chen-Liang Chu , Chih-Wen Yao , Ruey-Hsin Liu , Ming-Ta Lei
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L27/12 ; H01L29/66 ; H01L29/786

Abstract:
Some embodiments of the present disclosure relate to deceasing off-state leakage current within a metal-oxide-semiconductor field-effect transistor (MOSFET). The MOSFET includes source and drain regions. The source and drain regions are separated by a channel region. A gate is arranged over the channel region. The gate has a first gate region adjacent to the source region and a second gate region adjacent to the drain region. The first gate region is selectively doped adjacent the source region. The second gate region is undoped or lightly-doped. The undoped or lightly-doped second gate region reduces the electric field between the gate and the drain region, and hence reduces a gate induced drain leakage (GIDL) current between the gate and drain region. The undoped or lightly-doped region of the gate can reduce the GIDL current within the MOSFET by about three orders of magnitude. Other embodiments are also disclosed.
Public/Granted literature
- US10276596B2 Selective polysilicon doping for gate induced drain leakage improvement Public/Granted day:2019-04-30
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