Invention Application
- Patent Title: LASER MACHINING DEVICE AND LASER MACHINING METHOD
- Patent Title (中): 激光加工设备和激光加工方法
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Application No.: US14778619Application Date: 2014-03-13
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Publication No.: US20160052083A1Publication Date: 2016-02-25
- Inventor: Daisuke KAWAGUCHI , Tsubasa HIROSE , Keisuke ARAKI
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Priority: JP2013-065978 20130327
- International Application: PCT/JP2014/056724 WO 20140313
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/067 ; B23K26/53 ; B23K26/06

Abstract:
A laser processing device converges laser light at an object to be processed having a silicon part containing silicon mounted on a glass part containing glass with a resin part interposed therebetween so as to form a modified region within the object along a line to cut. The laser processing device comprises a laser light source emitting the laser light, a spatial light modulator modulating the laser light emitted from the laser light source, and a converging optical system converging the laser light modulated by the spatial light modulator at the object. When forming the modified region in the glass part, the spatial light modulator displays an axicon lens pattern as a modulation pattern so as to form converging points at a plurality of positions juxtaposed close to each other along a laser light irradiation direction.
Public/Granted literature
- US09902016B2 Laser machining device and laser machining method Public/Granted day:2018-02-27
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