Invention Application
- Patent Title: LASER MACHINING DEVICE AND LASER MACHINING METHOD
- Patent Title (中): 激光加工设备和激光加工方法
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Application No.: US14778746Application Date: 2014-03-13
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Publication No.: US20160052085A1Publication Date: 2016-02-25
- Inventor: Daisuke KAWAGUCHI , Makoto NAKANO , Ryota SUGIO , Tsubasa HIROSE , Keisuke ARAKI
- Applicant: HAMAMATSU PHOTONICS K.K.
- Priority: JP2013-065987 20130327
- International Application: PCT/JP2014/056725 WO 20140313
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/53 ; B23K26/06

Abstract:
A laser processing device converges laser light at an object to be processed so as to form a modified region within the object along a line to cut. The laser processing device comprises a laser light source emitting the laser light, a spatial light modulator modulating the laser light emitted from the laser light source, and a converging optical system converging the laser light modulated by the spatial light modulator at the object. The spatial light modulator displays an axicon lens pattern as a modulation pattern so as to form converging points at a plurality of positions juxtaposed close to each other along a laser light irradiation direction.
Public/Granted literature
- US09914183B2 Laser machining device and laser machining method Public/Granted day:2018-03-13
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